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13. Interlaminar repairing and thermoforming properties of carbon fiber reinforced Vitrimer epoxy resin composites

Author

FANG Mei, LU Bo, HUANG Ming, FENG Yuezhan, LIU Chuntai, and SHEN Changyu

Subjects
vitrimer, carbon fiber reinforced composite, interlayer repairing, thermoforming process, ester bond exchange reaction, Materials of engineering and construction. Mechanics of materials, TA401-492
Abstract

The interlaminar repairing behavior and thermoforming capacity of new carbon fiber reinforced Vitrimer epoxy resin (V-CFRP) composite and corresponding mechanisms were studied. The results reveal that the glass transition temperature (Tg) of the new Vitrimer epoxy resin is 92.8 ℃, and it exhibits significant stress relaxation behavior at temperatures higher than Tg. The stress relaxation time exhibits a linear relationship with temperature; The hot-press repair behavior and thermoplastic molding ability of V-CFRP composites were studied using a three-point bending experiment. The hot-press repair study shows that hot pressing at 180-220 ℃ for 1.5-2.0 h and 5 MPa can achieve nearly 100% repair of interlaminar damage in the composite; The bending modulus and bending strength of V-CFRP composites is decreased by more than 80% after pre-heating at 180-220 ℃ for 5-30 min. The significant decrease of bending modulus means that V-CFRP composite is suitable for thermoforming process. Moreover, a V-CFRP part with three-dimensional structure is successfully prepared by thermoforming process under the conditions of 200 ℃, 5 MPa and 2 h, which confirms the thermoforming capacity of V-CFRP composites.

Published
2023
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46. Scalable Sol–Gel Permeation Assembly of Phase Change Layered Film Toward Thermal Management and Light‐Thermal Driving Applications.

Author

Han, Gaojie, Cheng, Hongli, Cheng, Yajie, Zhou, Bing, Liu, Chuntai, and Feng, Yuezhan

Subjects
HEAT storage, PHASE transitions, THERMAL conductivity, ELECTRONIC equipment, POLYETHYLENE glycol
Abstract

Phase change materials (PCMs) are pivotal in thermal energy management and conversion applications owing to their exceptional thermal energy storage and release characteristics. However, persistent challenges such as poor thermal conductivity and leakage issues have impeded their widespread adoption. While existing approaches mitigate these challenges by constructing and incorporating 3D thermal conductive networks, they are constrained by discontinuous preparation methods and mold size limitations. Herein, a scalable sol–gel permeation assembly strategy is proposed to prepare phase change layered film by in situ filling polyethylene glycol (PEG) in aramid nanofibers (ANF)/graphene nanoplates (GNP) network. Befitting from the laminated network encapsulation effect of ANF and GNP, the phase change film demonstrates leak‐free and stable phase transition behavior, even after undergoing 500 heating/cooling cycles. Moreover, the resulting PEG/ANF/GNP layered film exhibits an impressive in‐plane thermal conductivity of 23.7 W mK−1 at GNP loading of 28.1 vol.%, rendering it suitable for thermal management applications in electronic devices. The phase change layered film possesses exceptional photo‐thermal conversion properties, maintaining temperatures exceeding 90 °C under a light power density of 200 mW cm−2. Capitalizing on the thermally induced flexibility of the phase transition film and its temperature‐dependent stiffness, its utility extended to developing a light‐thermal driving gripper. [ABSTRACT FROM AUTHOR]

Published
2024
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