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3. Review of Topside Interconnections for Wide Bandgap Power Semiconductor Packaging.

5. Energy storage and power management for typical 4Q-load

6. Reaching high power density in multikilowatt DC-DC converters with galvanic isolation

7. Review of Packaging Schemes for Power Module

9. High density packaging of the passive components in an automotive dc/dc converter

10. A high-density heat-sink-mounted inductor for automotive applications

11. Loss modeling and thermal measurement in planar inductors--a case study

12. Current sharing between diode clamps of polar capacitor bank

13. A volumetric optimization of a low-pass filter

17. Effects of scaling high-frequency transformer parameters

18. A thermal model for high-frequency magnetic components

35. Some Limits of Integrated L-C-T Modules for Resonant Converters at 1 MHz

36. Dielectric Measurements for Power Electronic Applications

50. A Generic Matrix Method to Model the Magnetics of Multi-Coil Air-Cored Inductive Power Transfer Systems.

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