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This white paper consists of evidence-based recommendations for conducting forensic interviews with children. The recommendations are jointly drafted by researchers in child interviewing active within the European Association of Psychology and Law and are focused on cases in which children are interviewed in forensic settings, in particular within investigations of child sexual and/or physical abuse. One particular purpose of the white paper is to assist the growing Barnahus movement in Europe to develop investigative practise that is science-based. The key recommendations entail the expertise required by interviewers, how interviews should be conducted and how interviewers should be trained. Interviewers are advised to use evidence-based interview protocols, engage in hypothesis-testing and record their interviews. The need to prepare the interview well and making efforts to familiarise the child with the interview situation and create rapport as well as acknowledging cultural factors and the possible need for interpretation is underscored, and a recommendation is made not to rely on dolls, body diagrams and the interpretation of drawings in the interviews. Online child interviewing is noted as showing promising results, but more research is warranted before conclusive recommendations can be made. Interviewers should receive specialised training and continuous feedback on their interviews. [ABSTRACT FROM AUTHOR]

We demonstrate a coupled equipment- and feature-scale process simulation and its application to plasma-enhanced chemical vapor deposition (PECVD) as part of a sequence for the fabrication of a through-silicon via (TSV) interconnect. The TSV structure is characterized electrically and mechanically by means of finite element simulation. This chain allows one to determine the effects of process variations on the electrical and reliability characteristics of the TSV. The simulations predict an across wafer variation of the parasitic DC capacitance between the tungsten metallization and the silicon substrate of about 3%. However, mechanical simulations indicate only a minor influence of the oxide layer thickness variation on the reliability performance of the TSV. [ABSTRACT FROM AUTHOR]