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Ultralow‐k materials with promising comprehensive performance to meet the increasing requirements of high‐frequency communication are highly desired. Here, a cross‐linked porous polymer SiCOH, synthesized via simple sol–gel method, was used as the filler to prepare SiCOH/PI composite films by physically blending, which demonstrates ultralow dielectric constant at high frequency. Notably, only 2.5% of SiCOH in the composite can significantly reduce the dielectric constant of PI from 3.0 to an ultralow value of 1.7 in the 9.5–12.4 GHz, together with a low dielectric loss of 0.029. Additionally, the SiCOH/PI composite maintains a high tensile strength of 82.4 MPa and a tensile modulus of 1.82 GPa, which is comparable to pure PI film. While the glass transition temperature (Tg) increases to 370°C and the linear expansion coefficient is reduced to 30.7 ppm/°C, both of which are superior to those of pure PI film. Moreover, by introducing the hydrophobic SiCOH into PI, the contact angle of the composite films increased to 92.0°–99.0°. This simple and low‐cost method not only effectively lowers the dielectric constant of PI but also improves the thermal stability, mechanical properties, and hydrophobic ability, greatly boosts the practical application of PI in high‐frequency communication in the future. [ABSTRACT FROM AUTHOR]

Fire disasters in tall buildings can cause considerable damage to property, injuries to people and death. An effective way to reduce injuries or death during a fire is to improve human evacuation behavior. Many studies have demonstrated that behavioral skills training can effectively help people of different ages to acquire safety skills for emergencies. Based on virtual reality (VR), serious games (SGs) and behavioral skills training (BST), this study proposes a theoretical model of "VR-SG-BST" as a fire safety training method. Older adults in care facilities were selected to evaluate the proposed model because their lack of knowledge on fire safety and the associated potential health problems increase the likelihood that they will become victims of a fire. It is expected that engagement and immersion in the SG can improve the elderly's learning performance of fire evacuation skills and enhance their interest and sense of fun experienced during fire safety training. The SG could effectively improve the skills of evacuation in an emergency. Hence, this study involved two parallel investigations: 1) comparing fire safety behavior of the elderly between an experimental and a control group, and 2) determining the effects of BST for fire safety by comparing only the experimental group in pre- and post-BST phases. The study adopts in situ training (IST) to evaluate the acquisition of knowledge and skills during the experimental stage. It is concluded that the proposed VR-SG-BST model has potential to serve as an alternate approach to improve the elderly's behavioral skills during a fire. Moreover, previous computer game experience enhances the elderly's learning performance and fire safety behavior. The outcomes of the study provide suggestions and guidelines for VR-SG design in the practice of BST. [ABSTRACT FROM AUTHOR]

This research investigates the synthesis and evaluation of cyclic olefin copolymer (COC) composites with surface‐engineered boron nitride nanosheets (BNNs) at various concentrations. The study focuses on the impact of Cetyltrimethylammonium bromide (CTAB) on BNNs′ surface functionalization to improve their dispersion within the COC matrix, including its dielectric behavior, dielectric breakdown strength, thermal management capabilities, hygroscopic properties, and mechanical robustness. The methodological approach adopted for the fabrication of COC/BNNs hybrid composites commenced with the synthesis of BNNs, surface functionalization of BNNs, in‐situ mixing and hot‐press. This step aimed to enhance compatibility and adhesion between BNNs and the COC matrix, facilitating more homogeneous nanofiller dispersion. The investigative scope of this study encompassed a rigorous evaluation of the resultant composites, with a particular emphasis on their dielectric properties. The dielectric constant (ϵ′) and loss tangent (δ) were measured at a frequency of 10 GHz, revealing an ultra‐low dielectric constant of 1.28, an exceptionally minimal loss tangent of 0.000146, a remarkable 327% (In‐plane) & 129% (axial) increase of thermal conductivity, significant improvement of dielectric breakdown strength up to 88.4 mV/mm, and low water absorptions observed. These results indicate the potential of COC/BNNs composites for high‐frequency electronic packaging applications requiring low dielectric constants. [ABSTRACT FROM AUTHOR]

Purpose: The purpose of this study is to improve the mechanical property and processing performance and reduce the cost of the polylacticacid/polybutyleneadipate-co-terephthalate(PLA/PBAT) composites, the calcium carbonate (CaCO3) and compatibilizer styrene-maleicanhydride copolymer (SMA-2025) were added to the PLA/PBAT system, and the effect of CaCO3 and SMA-2025 on the morphology, structure, mechanical property, thermal property, thermalstability and shape memory property of the CaCO3/PLA/PBAT composites were studied and discussed. Design/methodology/approach: The CaCO3/PLA/PBAT shape memory composites were prepared via melt-blending and hot-pressing methods, and the effect of CaCO3 and SMA-2025 on the property of the composites was investigated via scanning electron microscope, universal testing instrument, Fourier transform infrared spectroscopy, differential scanning calorimetry, thermogravimetric analysis and DMA, respectively. Findings: The interface property, mechanical property, thermal stability, shape memory recovery ratios and recovery stresses, and processing performance of the CaCO3/PLA/PBAT shape memory composites were significantly improved by adding of CaCO3 and SMA-2025. Moreover, the CaCO3/PLA/PBAT composites have good blowing film processing performance. Originality/value: This study will provide a reference for the research, processing and application of the high-performance CaCO3/PLA/PBAT shape memory composites. [ABSTRACT FROM AUTHOR]

The expanding realm of high‐frequency electronics necessitates materials with exceptional attributes: notably, a low dielectric constant (Dk) to minimize signal propagation delays, high thermal conductivity for effective heat dissipation, higher breakdown strength, and robust mechanical properties to withstand demanding operational environments. While cycloolefin copolymers (COC) excel in electrical insulation, chemical resistance, and mechanical durability, their intrinsic slightly higher dielectric constant compared to other polymers, along with challenges such as poor dispersibility and low compatibility with nanoparticles, hinder their full potential in this domain. Considering these drawbacks, this study fabricated a series of COC/mica composites by integrating natural mica particles into the COC matrix via a CTAB‐assisted surface modification of mica to enhance dispersibility and mitigating particle aggregation through in‐situ mixing and hot‐press methods. The resultant composites demonstrate an outstanding ultra‐low Dk of 1.44, marking a significant decrease of over 36% compared to pristine COC with a Dk of 2.26, along with exceptionally low dielectric loss (δ) of 0.00013 at the frequency of 10 GHz, high dielectric breakdown strength ~49.40 kV/mm and enhanced thermal conductivity up to 0.88 W/(m K) at 40% mica loading. Additionally, the composites heightened mechanical performances like tensile strength 69 MPa at 6.5% elongation at break, impact strength up to ~17.9 kJ × m−2, and exceptional water resistance with absorption below 0.097%. These exceptional ultra‐low dielectric performance with above mentioned properties can meet the stringent requirements of modern high‐frequency electronics packaging for next generation electronics development. Highlights: Surface modification by CTAB enhanced homogeneous dispersibility of composites.Achieved ultra‐low dielectric constant and loss compared to pure COC.Thermal conductivity improved significantly with incorporation of mica.Unlocking high‐frequency applications potential with ultralow Dk performance. [ABSTRACT FROM AUTHOR]