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1. Exchange control in a MOS double quantum dot made using a 300 mm wafer process

2. Physics-Based and Closed-Form Model for Cryo-CMOS Subthreshold Swing

3. Low charge noise quantum dots with industrial CMOS manufacturing

4. Modelling semiconductor spin qubits and their charge noise environment for quantum gate fidelity estimation

5. Overcoming I/O bottleneck in superconducting quantum computing: multiplexed qubit control with ultra-low-power, base-temperature cryo-CMOS multiplexer

6. High mobility SiMOSFETs fabricated in a full 300mm CMOS process

7. Millikelvin temperature cryo-CMOS multiplexer for scalable quantum device characterisation

9. Low-loss α-tantalum coplanar waveguide resonators on silicon wafers: fabrication, characterization and surface modification

13. Low charge noise quantum dots with industrial CMOS manufacturing

15. Overcoming I/O bottleneck in superconducting quantum computing: multiplexed qubit control with ultra-low-power, base-temperature cryo-CMOS multiplexer

16. Scalable 1.4 μW cryo-CMOS SP4T multiplexer operating at 10 mK for high-fidelity superconducting qubit measurements

18. High mobility SiMOSFETs fabricated in a full 300 mm CMOS process

22. Millikelvin temperature cryo-CMOS multiplexer for scalable quantum device characterisation

23. Poster: Memristive Systems

27. Fabrication and room temperature characterization of trilayer junctions for the development of superconducting qubits on 300 mm wafers

29. On the calculation of the quasi-bound-state energies and lifetimes in inverted MOS structures with ultrathin oxides and its application to the direct tunneling current

31. CMOS Compatible Josephson Junctions for Superconducting Qubit Applications

32. Fabrication and Room Temperature Characterization of Trilayer Junctions for the Development of 300 mm Compatible Superconducting Qubits

34. Ovonic Threshold‐Switching GexSey Chalcogenide Materials: Stoichiometry, Trap Nature, and Material Relaxation from First Principles

35. First-principles thermodynamics and defect kinetics guidelines for engineering a tailored RRAM device.

41. High-k Dielectrics and Metal Gates for Future Generation Memory Devices

42. Interfacial Properties of nMOSFETs With Different Al2O3 Capping Layer Thickness and TiN Gate Stacks.

43. TDDB Mechanism in a-Si/TiO2 Nonfilamentary RRAM Device

44. Ovonic Threshold‐Switching GexSey Chalcogenide Materials: Stoichiometry, Trap Nature, and Material Relaxation from First Principles.

47. Investigation of Preexisting and Generated Defects in Nonfilamentary a-Si/TiO2 RRAM and Their Impacts on RTN Amplitude Distribution

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