1. 6th IBM IEEE CAS/EDS AI Compute Symposium (AICS’23) [CASS Conference Highlights].
- Author
-
Joshi, Rajiv, Ziegler, Matthew, Han, Jin-Ping, and Maghraoui, Kaoutar El
- Abstract
The 6th IBM IEEE CAS/EDS AI Compute Symposium was held hybrid at the T. J. Watson Research Center on 28 November 2023. The event was extremely successful and well attended by over 2000 folks from all over the world (in-person and virtual). The symposium featured 8 distinguished speakers (7 from industry and 1 from academia), over 30 student in-person posters, best poster awards, and a panel discussion. The registration list spanned citizens of 53 countries. The theme of the symposium, “From Chips to Chiplets,” turned out to be an opportune and important topic for the current semiconductor industry direction. The symposium served as an educational as well as a brainstorming session for industry/academia/students across the world. The symposium covered a range of topics from emerging device technology, innovative circuits, chip and chiplet architecture, advanced packaging technologies, such as 2D to 3D packaging elements, and how these topics drive the rapid growth of AI and generative AI. Dr. Rajiv Joshi, General Chair and IEEE Life Fellow opened the symposium with welcoming remarks along with the goals and accomplishments of this symposium under the auspices of CAS and IBM. [ABSTRACT FROM AUTHOR]
- Published
- 2024
- Full Text
- View/download PDF