144 results on '"Hsieh, Ker-Chang"'
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2. Revisiting the softening and melting behavior of sinter under simulated blast furnace conditions: Part I – Thermodynamic and experimental insights on working line
3. Nano-structure to Laves phase: Reduced Thermal Conductivity from Medium-Entropy AlNbV to High-Entropy AlNbVCrTi Alloys
4. Studies of interface reactions between zinc and reduced red scale on a Mn/Si dual phase steel
5. The orientation relationships of the Cu3Sn/Cu interfaces and a discussion of the formation sequence of Cu3Sn and Cu6Sn5
6. Cu wire bond microstructure analysis and failure mechanism
7. Phase diagram of Au-Al-Pd at 500°C
8. Phase diagram of Au-Al-Cu at 500°C
9. Phase Equilibrium in the Ni-Ti-Zr System at 800 °C
10. Orientation relationships, interfaces, and microstructure of η-Cu 6Sn 5 formed in the early-stage reaction between Cu and molten Sn
11. The microstructure of η′-Cu 6Sn 5 and its orientation relationships with Cu in the early stage of growth
12. The effect of tin grain structure on whisker growth
13. Corrosion behavior of pure tin deposit under 55 °C/85 % RH reliability test
14. The microstructure and phase equilibrium of new high performance high-entropy alloys
15. Synthesis of copper-rich amorphous alloys by computational thermodynamics
16. Thermodynamic properties and phase equilibria of Sn–Bi–Zn ternary alloys
17. The Mechanism of Residual Stress Relief for Various Tin Grain Structures
18. Development of Novel Lightweight Al-Rich Quinary Medium-Entropy Alloys with High Strength and Ductility
19. Sn-Cu Intermetallic Grain Morphology Related to Sn Layer Thickness
20. The formation and growth of intermetallic compounds in Sn-Zn and Sn-Zn-Al solder with Ni/Au surface finish bond pad
21. Phase reaction in Sn–9Zn solder with Ni/Au surface finish bond-pad at 175 °C ageing
22. Bromine- and chlorine-induced degradation of gold-aluminum bonds
23. The effect of Pd and Cu in the intermetallic growth of alloy Au wire
24. Interfacial microstructure of Pb-free and Pb-Sn solder balls in the ball-grid array package
25. Intermetallic growth of wire-bond at 175°C high temperature aging
26. Computational thermodynamics to identify Zr–Ti–Ni–Cu–Al alloys with high glass-forming ability
27. Phase equilibrium in the Cu–Ni–Zr system at 800 °C
28. Ag and Cu migration phenomena on wire-bonding
29. Development of Novel Lightweight Dual-Phase Al-Ti-Cr-Mn-V Medium-Entropy Alloys with High Strength and Ductility
30. From Nano-Structure to Laves Phase: Reduced Thermal Conductivity from Medium-Entropy Alnbv to High-Entropy Alnbvcrti Alloys
31. Crucial Mechanism to the Eutectoid Transformation of Wüstite Scale on Low Carbon Steel
32. A urine testing chip based on the complementary split-ring resonator and microfluidic channel
33. Non-contact detecting solution ionic strength in microfluidic channel utilizing GHz complementary split-ring resonator (CSRR)
34. Crucial Mechanism to the Eutectoid Transformation of Wüstite Scale on Low Carbon Steel
35. The Fe−Ni−S system above 700°C (Iron−Nickel−Sulfur)
36. A thermodynamic analysis of the phase equilibria of the Fe-Ni system above 1200 K
37. A solid-state emf study of ternary Ni-S-O, Fe-S-O, and quaternary Fe-Ni-S-O
38. A thermogravimetric investigation of the Fe-Ni-S system from 700 to 900°C
39. Oxygen potentials and phase equilibria of the quaternary Y-Ba-Cu-O system in the region involving the YBa2Cu3O7−x phase
40. The intermetallic compound (IMC) growth and phase identification of different kinds of copper wire and Al pad thickness
41. A solid-state emf study of the Cu-Cu2O-NiO three-phase equilibrium
42. Corrosion behavior of pure tin deposit under 55 °C/85 % RH reliability test
43. Phase Equilibrium in the Ni-Ti-Zr System at 800 °C
44. Orientation relationships, interfaces, and microstructure of η-Cu6Sn5 formed in the early-stage reaction between Cu and molten Sn
45. The microstructure of η′-Cu6Sn5 and its orientation relationships with Cu in the early stage of growth
46. Designing Ductile Zr-Based Bulk Metallic Glasses with Phase Separated Microstructure
47. Phase Equilibrium in the Cu–Ti–Zr System at 800°C
48. Phase reaction in Sn–9Zn solder with Ni/Au surface finish bond-pad at 175°C ageing
49. Effects of Photosensitive Film Sidewall Profile with Different Exposure Wavelength and Process Characteristics of Wafer Bump Technology
50. Erratum
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