Search

Your search keyword '"Hsin, Y.-C."' showing total 13 results
Start Over Author "Hsin, Y.-C."

Refine your results

13 results on '"Hsin, Y.-C."'

1. The First CMOS-Integrated Voltage-Controlled MRAM with 0.7ns Switching Time

Author

Suhail, H., primary, He, H., additional, Yang, J., additional, Shu, Q., additional, Wang, C. -Y., additional, Yang, S. -Y., additional, Hsin, Y. -C., additional, Shih, C. -Y., additional, Lee, H. -H., additional, Wu, D., additional, Lee, A., additional, Wei, J. -H., additional, Gupta, P., additional, Wang, K. L., additional, and Pamarti, S., additional

Published
2023
Full Text
View/download PDF

2. High RA Dual-MTJ SOT-MRAM devices for High Speed (10ns) Compute-in-Memory Applications

Author

Song, M. Y., primary, Chen, K. L., additional, Chen, K. M., additional, Chang, K. T., additional, Wang, I. J., additional, Hsin, Y. C., additional, Lin, C. Y., additional, Ambrosi, E., additional, Khwa, Win-San, additional, Lu, Y. L., additional, Hu, C. Y., additional, Yang, S. Y., additional, Li, S. H., additional, Wei, J. H., additional, Lee, T. Y., additional, Wang, Y. J., additional, Chang, M. F., additional, Pai, C. F., additional, and Bao, X. Y., additional

Published
2023
Full Text
View/download PDF

3. High speed (1ns) and low voltage (1.5V) demonstration of 8Kb SOT-MRAM array

Author

Song, M. Y., primary, Lee, C. M., additional, Yang, S. Y., additional, Chen, G. L., additional, Chen, K. M., additional, Wang, I J., additional, Hsin, Y. C., additional, Chang, K. T., additional, Hsu, C. F., additional, Li, S. H., additional, Wei, J. H., additional, Lee, T. Y., additional, Chang, M. F., additional, Bao, X. Y., additional, Diaz, C. H., additional, and Lin, S. J., additional

Published
2022
Full Text
View/download PDF

4. Development of Highly Manufacturable, Reliable, and Energy-Efficient Spin-Orbit Torque Magnetic Random Access Memory (SOT-MRAM)

Author

Rahaman, S. Z., primary, Chang, Y.-J., additional, Hsin, Y.-C., additional, Yang, S.-Y., additional, Chen, F.-M., additional, Chen, K.-M., additional, Wang, I-J., additional, Lee, H.-H., additional, Chen, G.-L., additional, Su, Y.-H., additional, Shih, C.-Y., additional, Chiu, S.-C., additional, Wei, J.-H., additional, Yen, S.-C., additional, Huang, K.-C., additional, Chen, C.-C., additional, Chen, M.-C., additional, Sheu, S.-S., additional, Lo, W.-C., additional, Chang, S.-Z., additional, See, Y.-C., additional, Deng, D.-L., additional, and Wu, C.-I, additional

Published
2022
Full Text
View/download PDF

5. A Large Dynamic Range Current Sensor Using Magnetic Tunnel Junction on 8” Si process line

Author

Wang, D. Y., primary, Wang, I. J., additional, Lin, C. S., additional, Su, J. W., additional, Lee, H. H., additional, Hsin, Y. C., additional, Yang, S. Y., additional, Chang, Y. J., additional, Kuo, Y. C., additional, Su, Y.H., additional, Rahaman, S. Z., additional, Chen, G. L., additional, Li, S. H., additional, Wei, J. H., additional, Huang, K. C., additional, and Wu, C. I., additional

Published
2019
Full Text
View/download PDF

8. (Invited) Technologies and Challenges of Fine Pitch Backside Via-Last TSV Process Integration for 3DIC Applications

Author

Ku, Tzukun, primary, Lin, C. H., additional, Tzeng, P. J., additional, Chen, E. H., additional, Hsu, T. C., additional, Chen, S. C., additional, Wang, C. C., additional, Chen, J. C., additional, Chen, C. C., additional, Hsin, Y. C., additional, Liao, S. C., additional, Chang, P. C., additional, Lin, Y. M., additional, and Chang, Y. H., additional

Published
2013
Full Text
View/download PDF

9. Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300 mm Multi-Project Wafer (MPW)

Author

Lau, J. H., primary, Zhan, C.-J., additional, Tzeng, P.-J., additional, Lee, C.-K., additional, Dai, M.-J., additional, Chien, H.-C., additional, Chao, Y.-L., additional, Li, W., additional, Wu, S.-T., additional, Hung, J.-F., additional, Tain, R.-M., additional, Lin, C.-H., additional, Hsin, Y.-C., additional, Chen, C.-C., additional, Chen, S.-C., additional, Wu, C.-Y., additional, Chen, J.-C., additional, Chien, C.-H., additional, Chiang, C.-W., additional, Chang, H.-H., additional, Tsai, W.-L., additional, Cheng, R.-S., additional, Huang, S.-Y., additional, Lin, Y.-M., additional, Chang, T.-C., additional, Ko, C.-D., additional, Chen, T.-H., additional, Sheu, S.-S., additional, Wu, S.-H., additional, Chen, Y.-H., additional, Lo, W.-C., additional, Ku, T.-K., additional, Kao, M.-J., additional, and Hu, D.-C., additional

Published
2011
Full Text
View/download PDF

10. Impact of slurry in Cu CMP (chemical mechanical polishing) on Cu topography of Through Silicon Vias (TSVs), re-distribution layers, and Cu exposure

Author

Chen, J. C., primary, Tzeng, P. J., additional, Chen, S. C., additional, Wu, C. Y., additional, Chen, C. C., additional, Hsin, Y. C., additional, Lau, J. H., additional, Hsu, Y. F., additional, Shen, S. H., additional, Liao, S. C., additional, Ho, C. H., additional, Lin, C. H., additional, Ku, T. K., additional, and Kao, M. J., additional

Published
2011
Full Text
View/download PDF

11. Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300mm Multi-Project Wafer (MPW)

Author

Lau, J. H., primary, Zhan, C-J, additional, Tzeng, P-J, additional, Lee, C-K, additional, Dai, M-J, additional, Chien, H-C, additional, Chao, Y-L, additional, Li, W., additional, Wu, S-T, additional, Hung, J-F, additional, Tain, R-M, additional, Lin, C-H, additional, Hsin, Y-C, additional, Chen, C-C, additional, Chen, S-C, additional, Wu, C-Y, additional, Chen, J-C, additional, Chien, C-H, additional, Chiang, C-W, additional, Chang, H-H, additional, Tsai, W-L, additional, Cheng, R-S, additional, Huang, S-Y, additional, Lin, Y-M, additional, Chang, T-C, additional, Ko, C-D, additional, Chen, T-H, additional, Sheu, S-S, additional, Wu, S-H, additional, Chen, Y-H, additional, Lo, W-C, additional, Ku, T-K, additional, Kao, M-J, additional, and Hu, D-Q, additional

Published
2011
Full Text
View/download PDF

13. Increasing incidence of invasive Haemophilus influenzae disease in adults, Utah, USA.

Author

Rubach MP, Bender JM, Mottice S, Hanson K, Weng HY, Korgenski K, Daly JA, and Pavia AT

Subjects
Adolescent, Adult, Aged, Bacteremia microbiology, Bacteremia mortality, Haemophilus Infections microbiology, Haemophilus Infections mortality, Haemophilus influenzae classification, Humans, Incidence, Meningitis, Haemophilus epidemiology, Meningitis, Haemophilus microbiology, Meningitis, Haemophilus mortality, Middle Aged, Serotyping, Utah epidemiology, Young Adult, Bacteremia epidemiology, Haemophilus Infections epidemiology, Haemophilus influenzae pathogenicity
Abstract

Since the introduction of the Haemophilus influenzae type b vaccine, the incidence of invasive H. influenzae type b disease among children has fallen dramatically, but the effect on invasive H. influenzae disease among adults may be more complex. In this population-based study we examined the epidemiology and outcomes of invasive disease caused by typeable and nontypeable H. influenzae among Utah adults during 1998-2008. The overall incidence increased over the study period from 0.14/100,000 person-years in 1998 to 1.61/100,000 person-years in 2008. The average incidence in persons >65 years old was 2.74/100,000 person-years, accounting for 51% of cases and 67% of deaths. The incidence was highest for nontypeable H. influenzae (0.23/100,000 person-years), followed by H. influenzae type f (0.14/100,000 person-years). The case-fatality rate was 22%. The incidence of invasive H. influenzae in Utah adults appears to be increasing. Invasive H. influenzae infection disproportionately affected the elderly and was associated with a high mortality rate.

Published
2011
Full Text
View/download PDF

Catalog

Books, media, physical & digital resources
See catalog results