13 results on '"Hsin, Y.-C."'
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2. High RA Dual-MTJ SOT-MRAM devices for High Speed (10ns) Compute-in-Memory Applications
3. High speed (1ns) and low voltage (1.5V) demonstration of 8Kb SOT-MRAM array
4. Development of Highly Manufacturable, Reliable, and Energy-Efficient Spin-Orbit Torque Magnetic Random Access Memory (SOT-MRAM)
5. A Large Dynamic Range Current Sensor Using Magnetic Tunnel Junction on 8” Si process line
6. Hardware implementation of physically unclonable function (puf) in perpendicular STT MRAM
7. Three-tier chips stack with TSVs for backside illuminated image sensor/ADC/ISP
8. (Invited) Technologies and Challenges of Fine Pitch Backside Via-Last TSV Process Integration for 3DIC Applications
9. Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300 mm Multi-Project Wafer (MPW)
10. Impact of slurry in Cu CMP (chemical mechanical polishing) on Cu topography of Through Silicon Vias (TSVs), re-distribution layers, and Cu exposure
11. Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300mm Multi-Project Wafer (MPW)
12. Robust image watermarking based on multiple description vector quantisation
13. Increasing incidence of invasive Haemophilus influenzae disease in adults, Utah, USA.
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