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Aluminum scandium nitride (AlScN) has been receiving increasing interest for radio frequency microelectromechanical systems because of their higher achievable bandwidths owing to the larger piezoelectric response of AlScN compared to AlN. However, alloying scandium (Sc) with aluminum nitride (AlN) significantly lowers the thermal conductivity of AlScN due to phonon alloy scattering. Self-heating in AlScN devices potentially limits power handling, constrains the maximum transmission rate, and ultimately leads to thermal failure. We grew plasma-assisted molecular beam epitaxy (PAMBE) AlScN on AlN-Al2O3 and GaN-Al2O3 substrates, and compared the cross-plane thermal conductivity to current work on AlScN grown on Si substrates.

The heteroepitaxial growth and phase formation of Ga2O3 on Al-polar AlN(0001) templates by molecular-beam epitaxy (MBE) are studied. Three different MBE approaches are employed: (i) conventional MBE, (ii) suboxide MBE (S-MBE), and (iii) metal-oxide-catalyzed epitaxy (MOCATAXY). We grow phase-pure β-Ga2O3(2̄01) and phase-pure ϵ/κ-Ga2O3(001) with smooth surfaces by S-MBE and MOCATAXY. Thin film analysis shows that the crystallographic and surface features of the β-Ga2O3(2̄01)/AlN(0001) and ϵ/κ-Ga2O3(001)/AlN(0001) epilayers are of high crystalline quality. Growth and phase diagrams are developed to synthesize Ga2O3 on AlN by MBE and MOCATAXY and to provide guidance to grow Ga2O3 on several non-oxide surfaces, e.g., AlN, GaN, and SiC, by MBE, S-MBE, and MOCATAXY.

Due to its high breakdown electric field, the ultra-wide bandgap semiconductor AlGaN has garnered much attention recently as a promising channel material for next-generation high electron mobility transistors (HEMTs). A comprehensive experimental study of the effects of Al composition x on the transport and structural properties is lacking. We report the charge control and transport properties of polarization-induced 2D electron gases (2DEGs) in strained AlGaN quantum well channels in molecular-beam-epitaxy-grown AlN/AlxGa1−xN/AlN double heterostructures by systematically varying the Al content from x = 0 (GaN) to x = 0.74, spanning energy bandgaps of the conducting HEMT channels from 3.49 to 4.9 eV measured by photoluminescence. This results in a tunable 2DEG density from 0 to 3.7 × 1013 cm2. The room temperature mobilities of x ≥ 0.25 AlGaN channel HEMTs were limited by alloy disorder scattering to below 50 cm2/(V.s) for these 2DEG densities, leaving ample room for further heterostructure design improvements to boost mobilities. A characteristic alloy fluctuation energy of ≥1.8 eV for electron scattering in AlGaN alloy is estimated based on the temperature dependent electron transport experiments.

N-polar AlN epilayers were grown on the N-face of single-crystal bulk AlN substrates by plasma-assisted molecular beam epitaxy. A combination of in situ thermal deoxidation and Al-assisted thermal desorption at high temperature aided in removing native surface oxides and impurities from the N-polar surface of the substrate enabling successful homoepitaxy. Subsequent epitaxial growth of the AlN layer on the in situ cleaned substrates, grown in a sufficiently high Al droplet regime, exhibited smooth surface morphologies with clean and wide atomic steps. KOH etch studies confirmed the N-polarity of the homoepitaxial films. Secondary ion mass spectrometry profiles show Si and H impurity concentrations below the noise levels, whereas O and C impurity concentrations of ∼8×1017 and ∼2×1017 atoms/cm3 are observed, respectively. Although the structural defect densities are low, they interestingly appear as inversion domains of different dimensionalities.

The AlN/GaN/AlN heterostructure is attractive for microwave and millimeter-wave power devices due to its thin top barrier, tight carrier confinement, and improved breakdown voltage. This work explores the large-signal RF performance of high-electron-mobility transistors on this heterostructure. Results are highlighted by record high on-current of 3.6 A/mm, and record maximum oscillation frequency ( $f_{max}$ ) of 233 GHz. The load-pull power sweep at 10 GHz demonstrate a peak power added efficiency (PAE) of 22.7% with an associated gain ( $G_{T}$ ) of 8.7 dB and output power ( $P_{out}$ ) of 3 W/mm. When optimized for power, the peak $P_{out}$ of 3.3 W/mm has an associated PAE of 14.7% and $G_{T}$ of 3.2 dB. This first demonstration is encouraging for the mm-wave power potential of the AlN/GaN/AlN HEMT.

Wurtzite aluminum nitride (AlN) has attracted increasing attention for high-power and high-temperature operations due to its high piezoelectricity, ultrawide-bandgap, and large thermal conductivity k. The k of epitaxially grown AlN on foreign substrates has been investigated; however, no thermal studies have been conducted on homoepitaxially grown AlN. In this study, the thickness dependent k and thermal boundary conductance G of homoepitaxial AlN thin films were systematically studied using the optical pump–probe method of frequency-domain thermoreflectance. Our results show that k increases with the thickness and k values are among the highest reported for film thicknesses of 200 nm, 500 nm, and 1 μm, with values of 71.95, 152.04, and 195.71 W/(mK), respectively. Our first-principles calculations show good agreement with our measured data. Remarkably, the G between the epilayer and the substrate reported high values of 328, 477, 1180, and 2590 MW/(m2K) for sample thicknesses of 200 nm, 500 nm, 1 μm, and 3 μm, respectively. The high k and ultrahigh G of homoepitaxially grown AlN are very promising for efficient heat dissipation, which helps in device design and has advanced applications in micro-electromechanical systems, ultraviolet photonics, and high-power electronics.

β-Ga2O3 is a promising ultra-wide bandgap semiconductor whose properties can be further enhanced by alloying with Al. Here, using atomic-resolution scanning transmission electron microscopy, we find the thermodynamically unstable γ-phase is a ubiquitous structural defect in both β-(AlxGa1−x)2O3 films and doped β-Ga2O3 films grown by molecular beam epitaxy. For undoped β-(AlxGa1−x)2O3 films, we observe γ-phase inclusions between nucleating islands of the β-phase at lower growth temperatures (∼500–600 °C). In doped β-Ga2O3, a thin layer of the γ-phase is observed on the surfaces of films grown with a wide range of n-type dopants and dopant concentrations. The thickness of the γ-phase layer was most strongly correlated with the growth temperature, peaking at about 600 °C. Ga interstitials are observed in the β-phase, especially near the interface with the γ-phase. By imaging the same region of the surface of a Sn-doped β-(AlxGa1−x)2O3 after ex situ heating up to 400 °C, a γ-phase region is observed to grow above the initial surface, accompanied by a decrease in Ga interstitials in the β-phase. This suggests that the diffusion of Ga interstitials toward the surface is likely the mechanism for growth of the surface γ-phase and more generally that the more-open γ-phase may offer diffusion pathways to be a kinetically favored and early forming phase in the growth of Ga2O3. However, more modeling and simulation of the γ-phase and the interstitials are needed to understand the energetics and kinetics, the impact on electronic properties, and how to control them.

This article introduces a circuits model for a proposed spin-based device called a spin-orbit torque field-effect transistor (SOTFET) that can operate as a nonvolatile memory and logic device. The SOTFET utilizes an FET structure with a ferromagnetic-multiferroic (MF) gate-stack that enables read/compute and write functions to be isolated. This is achieved by a combination of a ferromagnetic layer that is programmable via spin-orbit torque coupled to an MF layer that also couples into the gate of a traditional FET. Additionally, this device has logic gate-like behavior and can be designed to operate in either AND or OR gate mode. We begin with a physics-based model of this device and derive a SPICE level model that can be integrated into the Cadence toolset. Using such a device we demonstrate MRAM, content addressable memories (CAM), and ternary CAM (TCAM) functionality with 3 to 5 transistors, a significant decrease over the CMOS alternative circuits, showing that such a device can enable low cost and compact associative memories not currently feasible with CMOS devices.

Spin-orbit torque (SOT) is a promising mechanism for writing magnetic memories, while field-effect transistors (FETs) are the gold-standard device for logic operation. The spin-orbit torque field-effect transistor (SOTFET) is a proposed device that couples an SOT-controlled ferromagnet to a semiconducting transistor channel via the transduction in a magnetoelectric multiferroic (MF). This allows the SOTFET to operate as both a memory and a logic device, but its realization depends on the choice of appropriate materials. In this report, we discuss and parametrize the types of materials that can lead to an SOTFET heterostructure.

We report a fully transparent thin-film transistor utilizing a La-doped BaSnO3 channel layer that provides a drain current of 0.468 mA/μm and an on-off ratio of 1.5 × 108. The La-doped BaSnO3 channel is grown on a 100–150 nm thick unintentionally doped BaSnO3 buffer layer on a (001) MgO substrate by molecular-beam epitaxy. Unpatterned channel layers show mobilities of 127–184 cm2 V−1 s−1 at carrier concentrations in the low to mid 1019 cm−3 range. The BaSnO3 is patterned by reactive ion etching under conditions preserving the high mobility and conductivity. Using this patterning method, a sub-micron-scale thin film transistor exhibiting complete depletion at room temperature is achieved.

Mn4N is a compound magnetic material that can be grown using MBE while exhibiting several desirable magnetic properties such as strong perpendicular magnetic anisotropy, low saturation magnetization, large domain size, and record high domain wall velocities. In addition to its potential for spintronic applications exploiting spin orbit torque with epitaxial topological insulator/ferromagnet bilayers, the possibility of integrating Mn4N seamlessly with the wide bandgap semiconductors GaN and SiC provides a pathway to merge logic, memory and communication components. We report a comparative study of MBE grown Mn4N thin films on four crystalline substrates: cubic MgO, and hexagonal GaN, SiC and sapphire. Under similar growth conditions, the Mn4N film is found to grow single crystalline on MgO and SiC, polycrystalline on GaN, and amorphous on sapphire. The magnetic properties vary on the substrates and correlate to the structural properties. Interestingly, the field dependent anomalous Hall resistance of Mn4N on GaN shows different behavior from other substrates such as a flipped sign of the anomalous Hall resistance.

We present a novel physics-inspired neural network (Pi-NN) approach for compact modeling. Development of high-quality compact models for devices is a key to connect device science with applications. One recent approach is to treat compact modeling as a regression problem in machine learning. The most common learning algorithm to develop compact models is the multilayer perceptron (MLP) neural network. However, device compact models derived using the MLP neural networks often exhibit unphysical behavior, which is eliminated in the Pi-NN approach proposed in this paper, since the Pi-NN incorporates fundamental device physics. As a result, smooth, accurate, and computationally efficient device models can be learned from discrete data points by using Pi-NN. This paper sheds new light on the future of the neural network compact modeling.

Layered 2-D crystals embrace unique features of atomically thin bodies, dangling bond free interfaces, and step-like 2-D density of states. To exploit these features for the design of a steep slope transistor, we propose a Two-dimensional heterojunction interlayer tunneling field effect transistor (Thin-TFET), where a steep subthreshold swing (SS) of ~14 mV/dec and a high on-current of ~300 μm are estimated theoretically. The SS is ultimately limited by the density of states broadening at the band edges and the on-current density is estimated based on the interlayer charge transfer time measured in recent experimental studies. To minimize supply voltage VDD while simultaneously maximizing on currents, Thin-TFETs are best realized in heterostructures with near broken gap energy band alignment. Using the WSe2/SnSe2 stacked-monolayer heterostructure, a model material system with desired properties for Thin-TFETs, the performance of both n-type and p-type Thin-TFETs is theoretically evaluated. Nonideal effects such as a nonuniform van der Waals gap thickness between the two 2-D semiconductors and finite total access resistance are also studied. Finally, we present a benchmark study for digital applications, showing the Thin-TFETs may outperform CMOS and III-V TFETs in term of both switching speed and energy consumption at low-supply voltages.

Topological crystalline insulators have been recently predicted and observed in rock-salt structure SnSe {111} thin films. Previous studies have suggested that the Se-terminated surface of this thin film with hydrogen passivation has a reduced surface energy and is thus a preferred configuration. In this paper, synchrotron-based angle-resolved photoemission spectroscopy, along with density functional theory calculations, is used to demonstrate that a rock-salt SnSe {111} thin film epitaxially grown on Bi_{2}Se_{3} has a stable Sn-terminated surface. These observations are supported by low-energy electron diffraction (LEED) intensity-voltage measurements and dynamical LEED calculations, which further show that the Sn-terminated SnSe {111} thin film has undergone a surface structural relaxation of the interlayer spacing between the Sn and Se atomic planes. In sharp contrast to the Se-terminated counterpart, the observed Dirac surface state in the Sn-terminated SnSe {111} thin film is shown to yield a high Fermi velocity, 0.50×10^{6} m/s, which suggests a potential mechanism of engineering the Dirac surface state of topological materials by tuning the surface configuration.

For the past two decades, repeatable resonant tunneling transport of electrons in III-nitride double barrier heterostructures has remained elusive at room temperature. In this work we theoretically and experimentally study III-nitride double-barrier resonant tunneling diodes (RTDs), the quantum transport characteristics of which exhibit new features that are unexplainable using existing semiconductor theory. The repeatable and robust resonant transport in our devices enables us to track the origin of these features to the broken inversion symmetry in the uniaxial crystal structure, which generates built-in spontaneous and piezoelectric polarization fields. Resonant tunneling transport enabled by the ground state as well as by the first excited state is demonstrated for the first time over a wide temperature window in planar III-nitride RTDs. An analytical transport model for polar resonant tunneling heterostructures is introduced for the first time, showing a good quantitative agreement with experimental data. From this model we realize that tunneling transport is an extremely sensitive measure of the built-in polarization fields. Since such electric fields play a crucial role in the design of electronic and photonic devices, but are difficult to measure, our work provides a completely new method to accurately determine their magnitude for the entire class of polar heterostructures.