8 results on '"Hung, Han-Tang"'
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2. Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate
3. Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling
4. Low-temperature transient liquid phase bonding via electroplated Sn/In–Sn metallization
5. Low Temperature SLID Bonding Approach in Fine Pitch Chip-stacking Structure with 30 μm-pitch Interconnections
6. Low Temperature and Pressureless Microfluidic Electroless Bonding Process for Vertical Interconnections
7. Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process
8. Effects of plating conditions on electroless Ni-P plating in the microchannel
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