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Two-component micro-powder injection moulding (2C-μPIM) is a prospective approach for fabricating bi-material micro-components of stainless steel 316L (SS316L) and 3 mol% yttria-stabilised zirconia (3YSZ) at an appealing cost. However, the fundamental challenge lies in preventing the formation of large-scale cracks at the interface of two different materials during sintering. This study investigated how SS316L nanoparticles in bimodally configured SS316L powder that incorporated both nanoparticles and microparticles influenced the sintering of 2C-μPIM-processed miniature bi-materials made of bimodal SS316L and 3YSZ. In this study, feedstocks were developed by integrating monomodal (micro-sized) SS316L powder, three types of nano/micro-bimodal SS316L powders, and 3YSZ powder individually with palm stearin and low-density polyethylene binders. The results indicated that increasing the SS316L nanoparticle content to 45 vol.% caused a 19.5% increase in the critical powder loading in the bimodal SS316L powder as compared to that in the monomodal SS316L powder. The addition of SS316L nanoparticles increased the relative density and hardness of the sintered bi-materials, with the maximum values obtained being 96.8% and 1156.8 HV, respectively. Field emission scanning electron microscopy investigations revealed that adding 15 vol.% and 30 vol.% SS316L nanoparticle contents reduced interface cracks in bi-materials significantly, while 45 vol.% resulted in a crack-free interface. [ABSTRACT FROM AUTHOR]

In laser-based powder bed fusion (L-PBF), the volumetric energy density (VED) controlled by laser power (LP) and scan speed (SS) significantly affects the desired surface quality. Any variations in the LP and SS on the VED notably affect the surface quality due to changes in laser powder interactions. Therefore, the present study concentrated on the effect of various combinations of LP and SS, i.e. low LP (160 W) with high SS (1250 mm/s), high LP (320 W) with low SS (410 mm/s), low LP (160 W) with low SS (550 mm/s) and high LP (320 W) with high SS (1100 mm/s). The wide range of varying VEDs was chosen between 29 and 177 J/mm3. The results showed the VED range between 66 and 90 J/mm3 exhibited minimum surface roughness parameters of 0.51 < Ra < 0.52 µm, 0.63 < Rq < 0.64 µm, and 2.53 < Rz < 2.79 µm. The specific impact of LP and SS combination between 160 and 320 W with 400–1250 mm/s by maintaining a constant VED of 66 J/mm3 was also investigated. At a constant VED of 66 J/mm3, the combination of 280 W and 960 mm/s shows minimum roughness parameters of Ra = 0.527 µm, Rq = 0.645 µm, and Rz = 2.446 µm. The results showed that the combination of low LP with low SS, high LP with high SS, low LP with high SS, and high LP with low SS, increases surface roughness. [ABSTRACT FROM AUTHOR]

The joining of lead-free Sn-3.0Ag-0.5Cu (SAC305) solder alloy to metal substrate with the addition of a porous Cu interlayer was investigated. Two types of porous Cu interlayers, namely 15 ppi—pore per inch (P15) and 25 ppi (P25) were sandwiched in between SAC305/Cu substrate. The soldering process was carried out at soldering time of 60, 180, and 300 s at three temperature levels of 267, 287, and 307 °C. The joint strength was evaluated by tensile testing. The highest strength for solder joints with addition of P25 and P15 porous Cu was 51 MPa (at 180 s and 307 °C) and 54 MPa (at 300 s and 307 °C ), respectively. The fractography of the solder joint was analyzed by optical microscope (OM) and scanning electron microscopy (SEM). The results showed that the propagation of fracture during tensile tests for solder with a porous Cu interlayer occurred in three regions: (i) SAC305/Cu interface; (ii) inside SAC305 solder alloy; and (iii) inside porous Cu. Energy dispersive X-ray spectroscopy (EDX) was used to identify intermetallic phases. Cu6Sn5 phase with scallop-liked morphology was observed at the interface of the SAC305/Cu substrate. In contrast, the scallop-liked intermetallic phase together with more uniform but a less defined scallop-liked phase was observed at the interface of porous Cu and solder alloy. [ABSTRACT FROM AUTHOR]

The fabrication of bi-material micro-components via two-component micro-powder injection moulding (2C-µPIM) from 3 mol% yttria-stabilised zirconia (3YSZ) and micro/nano bimodal stainless steel 316L (SS 316L) powders has received insufficient attention. Apart from this, retaining the bonding between ceramic and metal at different processing stages of 2C-µPIM is challenging. This study investigated the solvent and thermal debinding mechanisms of green bi-material micro-parts of 3YSZ and bimodal SS 316L without collapsing the ceramic/metal joining. In this research, feedstocks were prepared by integrating the powders individually with palm stearin and low-density polyethylene binders. The results demonstrated that during the solvent debinding process, the palm stearin removal rate in the bi-materials composed of 3YSZ and bimodally configured SS 316L feedstocks intensified with an increase in temperature. The establishment of interconnected pores in the solvent-debound components facilitated the thermal debinding process, which removed 99% of the binder system. Following sintering, the debound bi-materials exhibited a relative density of 95.3%. According to a study of the microstructures using field emission scanning electron microscopy, an adequate bond between 3YSZ and bimodal SS 316L was established in the micro-part after sintering. The bi-material sintered at 1350 °C had the highest hardness of 1017.4 HV along the joining region.