1. Etch Characteristics of Ferroelectric (Bi 4−x La x )Ti 3 O 12 Thin Films in an Inductively Coupled Plasma
- Author
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Chee Won Chung, Jin Koo Yoon, June Key Lee, Yo Han Byun, and Young Soo Song
- Subjects
Chemical solution deposition ,Materials science ,Analytical chemistry ,chemistry.chemical_element ,Condensed Matter Physics ,Ferroelectricity ,Electronic, Optical and Magnetic Materials ,Bismuth ,chemistry ,Etch pit density ,Control and Systems Engineering ,Materials Chemistry ,Ceramics and Composites ,Electrical and Electronic Engineering ,Thin film ,Reactive-ion etching ,Inductively coupled plasma ,Selectivity - Abstract
Reactive ion etching of ferroelectric (Bi 4 m x La x )Ti 3 O 12 (BLT) thin films has been studied using C 2 F 6 and HBr etch gases in an inductively coupled plasma (ICP). BLT thin films with bismuth layered-perovskite structure were prepared by chemical solution deposition method. Etch rate and etch selectivity of BLT films were investigated for each gas. The etch rate of 700∼900 A were obtained for C 2 F 6 gas while the etch rate by HBr gas were in the range of 700∼1100 A under the etch conditions used in this study. The etch profiles and surface morphologies of BLT films etched by each gas were observed using field emission scanning electron microscopy (FESEM). HBr chemistry turned out to be more effective in obtaining high etch rate and clean etch profile than C 2 F 6 chemistry.
- Published
- 2002
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