1. Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing
- Author
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Adam Korczyc, Joanna Branas, Agata Jasik, Jacek Ratajczak, Paweł Kozłowski, K. Regiński, Krzysztof Czuba, and Krzysztof Chmielewski
- Subjects
Technology ,Fabrication ,Materials science ,infrared photodetectors ,Infrared ,Annealing (metallurgy) ,chemistry.chemical_element ,Photodetector ,metallization ,Article ,thermal evaporation ,Surface roughness ,General Materials Science ,Microscopy ,QC120-168.85 ,business.industry ,QH201-278.5 ,Engineering (General). Civil engineering (General) ,TK1-9971 ,Sphere packing ,chemistry ,Descriptive and experimental mechanics ,indium bumps ,Optoelectronics ,wet etching ,annealing ,Direct shear test ,Electrical engineering. Electronics. Nuclear engineering ,TA1-2040 ,business ,Indium - Abstract
Indium-based micro-bump arrays, among other things, are used for the bonding of infrared photodetectors and focal plane arrays. In this paper, several aspects of the fabrication technology of micrometer-sized indium bumps with a smooth surface morphology were investigated. The thermal evaporation of indium has been optimized to achieve ~8 μm-thick layers with a small surface roughness of Ra = 11 nm, indicating a high packing density of atoms. This ensures bump uniformity across the sample, as well as prevents oxidation inside the In columns prior to the reflow. A series of experiments to optimize indium bump fabrication technology, including a shear test of single columns, is described. A reliable, repeatable, simple, and quick approach was developed with the pre-etching of indium columns in a 10% HCl solution preceded by annealing at 120 °C in N2.
- Published
- 2021