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Your search keyword '"Kaizu, Katsumi"' showing total 8 results
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8 results on '"Kaizu, Katsumi"'

1. A low-cost technique for reducing the simultaneous switching noise in sub-board packaging configurations

Author

Koike, Shinji and Kaizu, Katsumi

Subjects
Electronic packaging -- Research, Switching theory -- Research, Electromagnetic noise -- Research, Business, Engineering and manufacturing industries, Science and technology
Abstract

A study was conducted to characterize a method for minimizing simultaneous switching noises in sub-board packaging set-ups. A network analyzer setup diagram was utilized to determine the S(sub 21)-frequency response of the power supply planes. Output signals and the noise of the power-supply planes were determined using a sampling oscilloscope. Results indicated that a thin insulator film of substrate material can be utilized to minimize switching noises in sub-board packages.

Published
1998

2. High-speed signal transmission at the front of a bookshelf packaging system

Author

Koike, Shinji, Kaizu, Katsumi, and Kishimoto, Tohru

Subjects
Printed circuits -- Equipment and supplies, Switching circuits -- Research, Business, Engineering and manufacturing industries, Science and technology
Abstract

A connection configuration for high-speed signal transmission at the front of a bookshelf packaging system has been implemented, using a flexible printed-circuit (FPC) cable and front connector. This expands the size of the functional block. Results from high-speed signal-transmission experiments are presented, and error-free transmission was obtained, making it a promising method when implementing 20-Gb/s and faster switching systems.

Published
1997

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