40 results on '"Katnani, Ahmad"'
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2. Material Design and Development for Aqueous Base Compatible High-Performance Deep UV Negative-Tone Resists
3. Beam-Based Defect Localization using Electrons: EBIRCH Overview
4. Manufacturing issues
5. More diffraction effects
6. Advanced industrial S/TEM automation and metrology: Boundary of precision
7. SRAM PFET and NFET Super FIN Characterization
8. Toward Automated S/TEM Metrology of Advanced CMOS Devices: Journey to Obtain a Precise and Accurate Measurement
9. Advantages and Challenges of 3-D Atom Probe Tomography Characterization of FinFETs
10. Cross-sectional atom probe tomography sample preparation for improved analysis of fins on SOI
11. Practical Considerations in Quantitative Nanoscale Energy-Dispersive X-ray Spectroscopy (EDX) and Its Application in SiGe
12. A holistic metrology approach: hybrid metrology utilizing scatterometry, CD-AFM, and CD-SEM
13. Positive bilayer resists for 248- and 193-nm lithography
14. Extension of 248-nm optical lithography: a thin film imaging approach
15. Acid-sensitive arylether-protected poly(4-hydroxystyrene) derivatives for chemically amplified deep-UV positive resists
16. Photoresists using tetrahydropyranyl- and tetrahydrofuranyl-protected styrene maleic anhydride half-ester polymers
17. Probing the environmental stability and bake latitudes of acetal vs. ketal protected polyvinylphenol DUV resist systems
18. Effects of crosslinking agent on lithographic performance of negative-tone resists based on poly(p-hydroxystyrene)
19. New ESCAP-type resist with enhanced etch resistance and its application to future DRAM and logic devices
20. Process optimization of a positive-tone chemically amplified resist for 0.25-um lithography using a vector scan e-beam tool
21. KRS: An Environmentally Robutst Resist Based on Fast Reaction kinetics.
22. Substrate contamination effects in the processing of chemically amplified DUV photoresists
23. Environmentally stable chemically amplified DUV resist based on diazoketone chemistry
24. Evaluation of a new environmentally stable positive tone chemically amplified deep-UV resist
25. Chemically amplified negative resist for e-beam fabrication of x-ray masks
26. Positive bilayer resists for 248- and 193-nm lithography.
27. Extension of 248-nm optical lithography: a thin film imaging approach.
28. Photoresists using tetrahydropyranyl- and tetrahydrofuranyl-protected styrene maleic anhydride half-ester polymers.
29. A New Environmentally Stable Posyitve Tone Chemically Amplified Resist System - KRS
30. Resist optimization for SOR x-ray lithography using an orthogonal experimental design
31. Phase and transmission error study for the alternating-element (Levenson) phase-shifting mask
32. Method to improve setup and overlay performance on an excimer laser stepper using a unique DUV resist: KRS.
33. Process optimization of a positive-tone chemically amplified resist for 0.25-um lithography using a vector scan e-beam tool.
34. Substrate contamination effects in the processing of chemically amplified DUV photoresists.
35. Resist optimization for SOR x-ray lithography using an orthogonal experimental design.
36. Phase and transmission error study for the alternating-element (Levenson) phase-shifting mask.
37. Toward Automated S/TEM Metrology of Advanced CMOS Devices: Journey to Obtain a Precise and Accurate Measurement.
38. ADVANTAGES AND CHALLENGES OF 3-D ATOM PROBE TOMOGRAPHY CHARACTERIZATION OF FinFETs.
39. A New Environmentally Stable Posyitve Tone Chemically Amplified Resist System - KRS.
40. A holistic metrology approach: hybrid metrology utilizing scatterometry, CD-AFM, and CD-SEM
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