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GaAs surfaces require electrical and chemical passivation for semiconductor devices, but in order to have air stable passivation, high temperatures have been previously required in the passivation step. Here, we demonstrate air-stable, ex situ plasma passivation of GaAs using consecutive hydrogen and nitrogen plasmas at room temperature. No pre-clean using deoxidizing wet chemistry or other means is required. The hydrogen plasma step removes surface oxides and As, which leaves a Ga-rich layer that the nitrogen plasma then turns to GaN. The formed GaN layer efficiently passivates the surface. The plasma-passivated GaAs shows upto 5 × room-temperature photoluminescence after 1 year, and room-temperature time-resolved photoluminescence demonstrates robust passivation even after 3 years, both comparisons to similarly aged unpassivated GaAs. Atomic force microscopy was used to confirm that the passivated surfaces can be made smooth enough for microelectronic applications. Grazing incidence x-ray diffraction indicated that the nitride films are amorphous, and energy-dispersive x-ray spectroscopy was used to estimate the nitrogen content. We used a common inductively coupled plasma reactive ion etching system for plasma passivation, thus enabling the rapid adoption of this technique. [ABSTRACT FROM AUTHOR]

It has recently been proposed that back‐contacted III–V light‐emitting diodes (LEDs) could offer improved current spreading as compared to conventional mesa or double side contacted structures. This has inspired also experimental efforts to realize such structures, but fabrication methods for them have not yet been fully established. Herein, the use of unintentionally doped and partially carrier‐selective contacts (SC) is studied to realize back‐contacted indium gallium nitride (InGaN) LEDs. The sharp electroluminescence peak at 439 nm from the multiquantum well stack demonstrates that the approach allows fabricating back‐contacted InGaN LEDs without intentionally doped n‐GaN layers and without inflicting damage in the active region, often observed in alternative approaches relying on lateral doping and the use of high energy particles during fabrication. The samples are fabricated on a finger configuration with several finger widths between 1 and 20 μm. It is observed that the emission spreads most uniformly throughout the structure for fingers with the width of 5 μm. As shown by the simulations, with improved contact resistances, the structures reported herein could enable fabricating back‐contacted LEDs with unity injection efficiency and improved current spreading, offering a path toward large‐area LEDs without contact shading even in materials where n‐doping is elusive. [ABSTRACT FROM AUTHOR]

In this letter, we report the impact of epitaxial Gd2O3 on the electrical properties of an AlGaN/GaN high electron mobility transistor (HEMT) grown on a 150 mm diameter Si (111) substrate. Incorporation of epitaxial Gd2O3 grown by the molecular beam epitaxy technique under a metal gate (metal/Gd2O3/AlGaN/GaN) causes six orders of magnitude reduction in gate leakage current compared to metal/AlGaN/GaN HEMT. We observe that epi-Gd2O3 undergoes complete structural changes from hexagonal to monoclinic as the thickness of the layer is increased from 2.8 nm to 15 nm. Such structural transformation is found to have a strong impact on electrical properties whereby the gate leakage current reaches its minimum value when the oxide thickness is 2.8 nm. We find a similar trend in the density of interface traps (Dit) having a minimum value of 2.98 × 1012 cm−2 eV−1 for the epioxide layer of thickness 2.8 nm. Our measurements also confirm a significant increase in the two dimensional electron gas (2DEG) density (∼40%) at AlGaN/GaN interface with epioxide grown on AlGaN, thus confirming the contribution of epitaxial lattice strain on 2DEG modulation. [ABSTRACT FROM AUTHOR]