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Hydrogenation of polycrystalline silicon (poly-Si) passivating contacts is crucial for maximizing their passivation performance. This work presents the application of Al2O3 prepared by atomic layer deposition as a hydrogenating capping layer. Several important questions related to this application of Al2O3 are addressed by comparing results from Al2O3 single layers, SiNx single layers, and Al2O3/SiNx double layers to different poly-Si types. We investigate the effect of the Al2O3 thickness, the poly-Si thickness, the poly-Si doping type, and the postdeposition annealing treatment on the passivation quality of poly-Si passivating contacts. Especially, the Al2O3/SiNx stack greatly enhances the passivation quality of both n+ and p+ doped as well as intrinsic poly-Si layers. The Al2O3 layer thickness is crucial for the single-layer approach, whereas the Al2O3/SiNx stack is less sensitive to the thickness of the Al2O3 layer. A thicker Al2O3 layer is needed for effectively hydrogenating p+ compared to n+ poly-Si passivating contact. The capping layers can hydrogenate poly-Si layers with thicknesses up to at least 600 nm. The hydrogenation-enhanced passivation for n+ poly-Si is found to be more thermally stable in comparison to p+ poly-Si. These results provide guidelines on the use of Al2O3 capping layers for poly-Si contacts to significantly improve their passivation performance., Photovoltaic Materials and Devices, Electrical Sustainable Energy

The authors of this review article published in 20131 would like to correct some text and references relating to the first observations and publications on molecular layering. In Sec. II, “Early Years of Atomic Layer Processes” in the original article,1 the first two sentences of the fourth paragraph should instead say “The ALD principle, where surface reactions follow a binary sequence of self-limiting half-reactions, was reported under the name ‘molecular layering’ in the 1960s by S. I. Kol’tsov from Leningrad Technological Institute.2–6 These experiments were conducted under the scientific supervision of V. B. Aleskovskii. The ‘framework hypothesis,’ an antecedent to molecular layering, was proposed by V. B. Aleskovskii in 1952.6” In addition, again in this same section and paragraph, the last two sentences should instead say “In the 1969 article,3 the authors report that the initial reaction between TiCl4 and Si–OH tends to involve 3 Si–OH, forming one Ti–Cl, whereas after the first water step, the second TiCl4 exposure reacts with 2 Ti–OH, forming Ti–Cl2 groups. In the 1969 paper,3 a planar thin film was not produced or evaluated, although nanolayers were prepared by molecular layering at that time.6” These corrections do not affect other sections or the conclusions drawn in the article.

Electrodeposited cobalt phosphate has been reported as a valid alternative to noble metals as an electrocatalyst for the Oxygen Evolution Reaction (OER). In parallel, Atomic Layer Deposition (ALD) is increasingly being used in (photo)electrocatalytic applications. In this contribution we report on the electrocatalytic activity towards OER of ALD-prepared cobalt phosphate thin films. The selected ALD approach enables tuning of the Co-to-P atomic ratio, which is found to significantly affect the activity of the prepared electrocatalyst. Specifically, concurrently with a Co-to-P ratio increase from 1.6 to 1.9, the current density for OER increases from 1.77 mA/cm2 at 1.8 V vs. RHE (Reversible Hydrogen Electrode) to 2.89 mA/cm2 at 1.8 V vs. RHE. Moreover the sample with a Co-to-P ratio of 1.9 has superior performance when compared to electrodeposited cobalt phosphate thin films reported in the literature.

Plasma-assisted atomic layer deposition (ALD) of HfNx thin films using tris(dimethylamino)cyclopentadienylhafnium [CpHf(NMe2)3] as the Hf precursor and H2 plasma as the reducing co-reactant is reported. We previously concluded that the HfNx films prepared for a grounded substrate (0 V substrate potential) exhibited a rather high electrical resistivity of 9.0 × 10-1 Ω cm. In the present work, we show a steady decrease in the electrical resistivity by two orders of magnitude to 3.3 × 10-3 Ω cm upon increasing the time-averaged substrate potential up to -130 V by externally biasing the substrate. A further increase in potential up to -187 V led to an increase in electrical resistivity to 1.0 × 10-2 Ω cm. The variations in electrical resistivity with the potential were found to correlate with the extent of grain boundary scattering in the films, which significantly decreased upon increasing the potential up to -130 V, primarily due to major changes in the film chemical composition. The latter consisted in a decrease in O content from 20.1 at% under no bias to ≤ 2 at% for a potential of -130 V and an associated increase in the Hf3+ fraction from 0.65 to 0.82. The latter is key to the development of low resistivity δ-HfN. A further increase in potential to -187 V led to an increase in grain boundary scattering as a consequence of a major decrease in grain size as well as in-grain crystallinity. In view of advanced nanoelectronic devices, the HfNx layers were also deposited on 3D trench nanostructures at a potential of -130 V. A low oxygen content in the HfNx film was measured on both the planar and vertical topographies of the trenches. Overall, the time-averaged substrate potential has been shown to highly affect the chemical composition, microstructure and the associated electrical properties of the HfNx layers and can be used to tailor

Atomic layer etching (ALE) provides Ångström-level control over material removal and holds potential for addressing the challenges in nanomanufacturing faced by conventional etching techniques. Recent research has led to the development of two main classes of ALE: ion-driven plasma processes yielding anisotropic (or directional) etch profiles and thermally driven processes for isotropic material removal. In this work, we extend the possibilities to obtain isotropic etching by introducing a plasma-based ALE process for ZnO which is radical-driven and utilizes acetylacetone (Hacac) and O2 plasma as reactants. In situ spectroscopic ellipsometry measurements indicate self-limiting half-reactions with etch rates ranging from 0.5 to 1.3 Å/cycle at temperatures between 100 and 250 °C. The ALE process was demonstrated on planar and three-dimensional substrates consisting of a regular array of semiconductor nanowires (NWs) conformally covered using atomic layer deposition of ZnO. Transmission electron microscopy studies conducted on the ZnO-covered NWs before and after ALE proved the isotropic nature and the damage-free characteristics of the process. In situ infrared spectroscopy measurements were used to elucidate the self-limiting nature of the ALE half-reactions and the reaction mechanism. During the Hacac etching reaction that is assumed to produce Zn(acac)2, carbonaceous species adsorbed on the ZnO surface are suggested as the cause of the self-limiting behavior. The subsequent O2 plasma step resets the surface for the next ALE cycle. High etch selectivities (80:1) over SiO2 and HfO2 were demonstrated. Preliminary results indicate that the etching process can be extended to other oxides such as Al2O3.

Thin-film stacks of phosphorus oxide (POx) and aluminium oxide (Al2O3) are shown to provide highly effective passivation of crystalline silicon (c-Si) surfaces. Surface recombination velocities as low as 1.7 cm s-1 and saturation current densities J0 s as low as 3.3 fA cm-2 are obtained on n-type (100) c-Si surfaces passivated by 6 nm/14 nm thick POx/Al2O3 stacks deposited in an atomic layer deposition system and annealed at 450 °C. This excellent passivation can be attributed in part to an unusually large positive fixed charge density of up to 4.7 × 1012 cm-2, which makes such stacks especially suitable for passivation of n-type Si surfaces.

Despite the existence of several highly effective and well-characterized passivating materials for crystalline silicon surfaces, the topic of surface passivation and the investigation of new passivating materials remain of considerable interest for silicon photovoltaics research. However, the question of whether and under what circumstances a particular material will provide effective surface passivation remains difficult to answer. In this work, we provide an overview of recent insights relating to this question, drawing from our own work on novel passivation materials including MoOx, Nb2O5, TiOx, ZnO, and POx, and illustrated with experimental results. Factors that strongly influence the passivation performance include the use of pre-grown interfacial oxides, the film thickness, the annealing conditions, and the presence of capping layers. The impact of these factors on the surface passivation can vary widely from material to material. Therefore, all of these factors should be taken into account when investigating potential new surface passivation materials.

A method to avoid the stiction failure in nano-electro-opto-mechanical systems has been demonstrated by coating the system with an anti-stiction layer of Al2O3 grown by atomic layer deposition techniques. The device based on a double-membrane photonic crystal cavity can be reversibly operated from the pull-in back to its release status. This enables to electrically switch the wavelength of a mode over ~50 nm with a potential modulation frequency above 2 MHz. These results pave the way to reliable nano-mechanical sensors and optical switches.

Black silicon (b-Si) nanotextures can significantly enhance the light absorption of crystalline silicon solar cells. Nevertheless, for a successful application of b-Si textures in industrially relevant solar cell architectures, it is imperative that charge-carrier recombination at particularly highly n-type doped black Si surfaces is further suppressed. In this work, this issue is addressed through systematically studying lowly and highly doped b-Si surfaces, which are passivated by atomic-layer-deposited Al2O3 films or SiO2/Al2O3 stacks. In lowly doped b-Si textures, a very low surface recombination prefactor of 16 fA/cm2 was found after surface passivation by Al2O3. The excellent passivation was achieved after a dedicated wet-chemical treatment prior to surface passivation, which removed structural defects which resided below the b-Si surface. On highly n-type doped b-Si, the SiO2/Al2O3 stacks result in a considerable improvement in surface passivation compared to the Al2O3 single layers. The atomic-layer-deposited SiO2/Al2O3 stacks therefore provide a low-temperature, industrially viable passivation method, enabling the application of highly n- type doped b-Si nanotextures in industrial silicon solar cells., Photovoltaic Materials and Devices, Electrical Sustainable Energy

We report on two experimental studies carried out to reveal insight into the interaction of SiH3 radicals with the a-Si:H surface as assumed essential in the a-Si:H growth mechanism. The surface reaction probability β of SiH3 on the a-Si:H has been investigated by spectroscopic means as a function of the substrate temperature (50 - 450 °C) using the time-resolved cavity ringdown technique. The silicon hydrides -SiHx on the a-Si:H surface during deposition have been studied by the combination of in situ attenuated total reflection infrared spectroscopy and argon ion-induced desorption of surface hydrogen. For SiH3 dominated plasma conditions, it is found that the surface reactivity of SiH3 is independent of the substrate temperature with β = 0.30±0.03 whereas the silicon hydride composition on the a-Si:H surface changes drastically for increasing substrate temperature (from -SiH3 to = SiH2 to ≡SiH). The implications of these observations for the a-Si:H growth mechanism are addressed.