Author: "Klawuhn, E." - Searchworks@Jio Institute Digital Library Search Results

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6 results on '"Klawuhn, E."'

1. Microstructure and Texture of Electroplated Copper in Damascene Structures

Author: Gross, M. E., Lingk, C., Siegrist, T., Coleman, E., Brown, W. L., Ueno, K., Tsuchiya, Y., Itoh, N., Ritzdorf, T., Turner, J., Gibbons, K., Klawuhn, E., Biberger, M., Lai, W. Y. C., Miner, J. F., Wu, G., and Zhang, F.
Published: 1998
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2. Ti-based Barrier for Cu Interconnect Applications

Author: Wu, W., primary, Wu, H.-J., additional, Dixit, G., additional, Shaviv, R., additional, Gao, M., additional, Mountsier, T., additional, Harm, G., additional, Dulkin, A., additional, Fuchigami, N., additional, Kailasam, S. K., additional, Klawuhn, E., additional, and Havemann, R. H., additional
Published: 2008
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3. Ionized physical-vapor deposition using a hollow-cathode magnetron source for advanced metallization

Author: Klawuhn, E., primary, D’Couto, G. C., additional, Ashtiani, K. A., additional, Rymer, P., additional, Biberger, M. A., additional, and Levy, K. B., additional
Published: 2000
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4. A new hollow-cathode magnetron source for 0.10 μm copper applications.

Author: Ashtiani, K.A., Klawuhn, E., Hayden, D., Ow, M., Levy, K.B., and Danek, M.
Published: 2000
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5. A new hollow-cathode magnetron source for 0.10 μm copper applications

Author: Ashtiani, K.A., primary, Klawuhn, E., additional, Hayden, D., additional, Ow, M., additional, Levy, K.B., additional, and Danek, M., additional
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6. Integration of porous ultra low-k dielectric with CVD barriers

Author: Mosig, K., primary, Cox, H., additional, Klawuhn, E., additional, Suwwan de Felipe, T., additional, and Shiota, A., additional
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