116 results on '"Knechtel, Roy"'
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2. Ein Beitrag zur Temperaturpräzisionsmessung durch Drifterkennung an Platin-100-Messwiderständen in Dünnschichttechnologie.
3. Wafer Bonding in MEMS Technologies
4. Investigation of the Processing Behavior and Stability of Different Glass Frit Materials
5. Investigation of Anodic Bond Formation Process and Potential Use of the Results
6. List of contributors
7. Bonding of CMOS processed wafers
8. Glass frit bonding
9. Strength of bonded interfaces
10. Crowdsourcing als Möglichkeit zur Gewinnung atmosphärischer Messdaten/Crowdsourcing as a possibility for obtaining atmospheric measurement data
11. Bonding of CMOS Processed Wafers
12. Surface Micromachining
13. List of Contributors
14. Strength of Bonded Interfaces
15. Glass Frit Bonding
16. Anodic Bonding a Low Temperature Bonding Method for Processed MEMS and CMOS Wafers
17. Heat Conductivity Based Inner Cavity Pressure Monitoring and Hermeticity Monitoring for Glass Frit Wafer Bonded MEMS Devices
18. The Importance of Wafer Edge in Wafer Bonding Technologies and Related Wafer Edge Engineering Methods
19. International conference on wafer bonding for MEMS technologies and wafer level integration
20. Glass frit bonding: an universal technology for wafer level encapsulation and packaging
21. Chapter 41 - Strength of bonded interfaces
22. Chapter 28 - Bonding of CMOS processed wafers
23. Chapter 25 - Glass frit bonding
24. Chapter 19 - Surface micromachining
25. Glass Frit Wafer Bonding
26. Non-destructive Bond Strength Testing of Anodic Bonded Wafers
27. Surface Micromachining
28. Bonding of CMOS Processed Wafers
29. Glass Frit Bonding
30. List of Contributors
31. The Role of Wafer Edge in Wafer Bonding Technologies
32. Welcome Remarks - G01: Semiconductor Wafer Bonding: Science, Technology and Applications 16
33. Special issue WaferBond’13: “International Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration”
34. MICROPRINCE—Open Access Foundry Pilot Line for Elastomer Assisted Micro-Assembly
35. Adhesive wafer bonding for CMOS based lab-on-a-chip devices
36. Wafer Bonding Technologies in Industrial MEMS Processing - Potentials and Challenges
37. Aspects of Bonding Processed CMOS Wafers
38. Characterization and Qualification of Wafer-Bonded MEMS Devices
39. Dielectric Layer Transfer by Low-Temperature Wafer Bonding for Optical Characterization
40. Adhesive Wafer Bonding for CMOS based Lab-on-a-Chip Devices
41. Glass Frit Wafer Bonding for Encapsulating Monolithic Integrated CMOS-MEMS Devices
42. Chapter 31 - Glass Frit Bonding
43. Chapter 33 - Bonding of CMOS Processed Wafers
44. Chapter 24 - Surface Micromachining
45. Chapter 18 - Strength of Bonded Interfaces
46. Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors
47. Glass Frit Wafer Bonding - Sealed Cavity Pressure in Relation to Bonding Process Parameters
48. Surface Protection for Semiconductor Direct Bonding
49. Investigation of the Processing Behavior and Stability of Different Glass Frit Materials.
50. Investigation of Anodic Bond Formation Process and Potential Use of the Results.
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