444 results on '"Lee, Chin C."'
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2. Ultrasonic-enhanced silver‑indium transient liquid phase bonding in advancing rapid and low-temperature packaging
3. A phase-field model of electrochemical migration for silver-based conductive adhesives
4. Plasma-induced growth mechanism of surface-state silver oxide in nanoscale for low-temperature bonding technology
5. Atomistic insights into silver-indium solid solution softening mechanism for microelectronics packaging
6. Bonding of Si chips to low carbon steel boards using electroplated Sn solder
7. Solid solution softening and enhanced ductility in concentrated FCC silver solid solution alloys
8. Solid-state bonding of silicon chips to copper substrates with graded circular micro-trenches
9. Direct silver to aluminum solid-state bonding processes
10. A study on intermetallic compound formation in Ag–Al system and evaluation of its mechanical properties by micro-indentation
11. Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics
12. A corrosion study of Ag–Al intermetallic compounds in chlorine-containing epoxy molding compounds
13. A corrosion study of Ag-Al intermetallic compounds in chlorinecontaining epoxy molding compounds
14. A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging
15. Low Temperature VECSEL-to-Diamond Heterogeneous Integration with Ag-In Spinodal Nanostructured Layer
16. Novel Silver Solid-State Bonding Designs Between Two Copper Structures
17. Study of Anti-Tarnishing Mechanism in Ag-In Binary System by Using Semi-Quantum-Mechanical Approach
18. Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples
19. A reaction study of sulfur vapor with silver and silver–indium solid solution as a tarnishing test method
20. The growth and tensile deformation behavior of the silver solid solution phase with zinc
21. The growth and stress vs. strain characterization of the silver solid solution phase with indium
22. Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver–indium multilayer structure
23. A solid-state bonding technique of large copper wires for high power devices operating at high temperature
24. Single- and dual-site ventricular pacing entirely through the coronary sinus for patients with prior tricuspid valve surgery
25. New solid-state die-attach method using silver foil bonded on aluminum substrate by eutectic reaction
26. Fluxless Tin Bonding Process With Suppressed Intermetallic Growth
27. The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes
28. Complete elimination of Ag3Al in Ag wire bonds on Al by alloying In into Ag
29. Initial Success on Aluminum Circuit Board Technology
30. Advanced Bonding/Joining Techniques
31. Fluxless Bonding of Large Silicon Chips to Ceramic Packages Using Electroplated Eutectic Au/Sn/Au Structures
32. Intermetallic Reaction of Indium and Silver in an Electroplating Process
33. Abstract 15482: Variation in Right Atrial Sizes Affects Locations of the His Bundle and Coronary Sinus Os
34. A study on intermetallic compound formation in Ag–Al system and evaluation of its mechanical properties by micro-indentation
35. Plasma-Induced Growth Mechanism of Surface-State Silver Oxide in Nanoscale for Low-Temperature Bonding Technology
36. A Phase-Field Model of Electrochemical Migration for Silver-Based Conductive Adhesives
37. Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics
38. Advanced Bonding/Joining Techniques
39. Demonstration of silver micro-joints for flip-chip interconnect
40. Bonding and impedance matching of acoustic transducers using silver epoxy
41. Fluxless bonding of Si chips to aluminum boards using electroplated Sn solder
42. Fluxless Tin and␣Silver-Indium Bonding Processes for␣Silicon onto␣Aluminum
43. Thermal Stress Considerations in Die-Attachment
44. A study of chemical reactions of silver and indium at 180 °C
45. Barrier/bonding layers on bismuth telluride (Bi2Te3) for high temperature thermoelectric modules
46. Silver flip-chip technology by solid-state bonding
47. The moderating influence of demographic characteristics, social support, and religious coping on the effectiveness of a multicomponent psychosocial caregiver intervention in three racial ethnic groups
48. Fluxless bonding of silicon wafers to molybdenum substrates using electroplated tin-rich solder
49. Direct silver to copper bonding process
50. Flip-chip interconnect for coplanar strip lines
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