17 results on '"Lee, Taekoo"'
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2. Optimization of metal-ceramic bonding to enhance mechanical properties of ceramic matrix composite
3. Board level drop test and simulation of leaded and lead-free BGA-PCB assembly
4. Study of FBGA Burn Failure under THB Test
5. Board Level Thermal Cycle Reliability of BGA for a New Type of Pad Structure with OSP Surface Finish
6. Characteristics of Tin Whisker Growth on Matte Tin Surface Finishes by Acceleration Conditions
7. The Influences of Solder Composition and Pad Finish on the Reliability of Fine Pitch BGA Solder Joints
8. Insulation Degradation and Bias Acceleration Effect Study under THB Test
9. Fine MCP Decapsulation Technology Development
10. Solution for the Board Level Drop Test in Vertical Direction of BGA Package under Ultrahigh Acceleration
11. Interfacial Reaction and Joint Reliability of Sn-Ag-Cu/OSP-Cu Pad SMT Solder Joint
12. Solder Joint Thermal Fatigue Analysis of 48-FBGA
13. Board Level Drop Test Reliability for MCP Package
14. Drop Test Failure Analysis of SAC BGA Solder Joints Using Ni/Au and Cu-OSP Pad Finish
15. Simulation of Average Strain Energy Density (SED) in the BGA Soldering during the Drop Test
16. Finite element analysis for solder ball failures in chip scale package
17. Effect of deformation temperature on recrystallization temperature on copper polycrystals
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