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2. Desorption ionization of biomolecules on metals

Author

Hsu, Nien-Yeen, Tseng, Susan Yu, Wu, Chung-Yi, Ren, Chien-Tai, Lee, Yuan-Chang, Wong, Chi-Huey, and Chen, Chung-Hsuan

Subjects
Ionization -- Research, Biomolecules -- Properties, Degassing of metals -- Properties, Metals -- Properties, Time-of-flight mass spectrometry -- Methods, Sorption -- Research, Chemistry
Abstract

Direct desorption ionization of various types of biomolecules on metal substrates without the need of matrices was observed by a time-of-flight mass spectrometer. It provides a new convenient method for detection of small biomolecules without the confusion of ion peaks from matrix compounds. Simple commercial Al foil can be used as the substrate to obtain mass spectra of biomolecules without the need of an etching process to produce a porous surface such as with direct ionization on silicon (DIOS). The desorption and ionization mechanism is also discussed.

Published
2008

3. Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLP

Author

Shen, Wen-Wei, primary, Lin, Yu-Min, additional, Chang, Hsiang-Hung, additional, Kuo, Tzu-Ying, additional, Fu, Huan-Chun, additional, Lee, Yuan-Chang, additional, Lee, Shu-Man, additional, Lin, Ang-Ying, additional, Huang, Shin-Yi, additional, Chang, Tao-Chih, additional, Lee, Alvin, additional, Su, Jay, additional, Huang, Baron, additional, Bai, Dongshun, additional, Liu, Xiao, additional, and Chen, Kuan-Neng, additional

Published
2017
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4. Reliability evaluation of glass interposer module

Author

Lee, Ching-Kuan, primary, Wang, Jen-Chun, additional, Zhan, Chau-Jie, additional, Shen, Wen-Wei, additional, Fu, Huan-Chun, additional, Lee, Yuan-Chang, additional, Fan, Chia-Wen, additional, Chen, K. C., additional, Chang, Hsiang-Hung, additional, and Lu, Yung Jean Rachel, additional

Published
2016
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5. Backside-TSV process development and integration for 2∼3um small size TSV

Author

Hsu, Tzu-Chien, primary, Chang, Po-Chih, additional, Wang, Chung-Chih, additional, Chang, Yiu-Hsiang, additional, Chen, Tsuen-Sung, additional, Hsin, Yu-Chen, additional, Chen, Jui-Chin, additional, Lee, Yuan-Chang, additional, Chen, Shang-Chun, additional, Wang, Jen-Chun, additional, Hsu, Chao-Kai, additional, Lin, Su-Hsin, additional, Lo, Chiung-Yu, additional, Chang, Hsiang-Hung, additional, and Wang, Chih-Lin, additional

Published
2016
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7. Low-cost TSH (through-silicon hole) interposers for 3D IC integration

Author

Lau, John H., primary, Lee, Ching-Kuan, additional, Zhan, Chau-Jie, additional, Wu, Sheng-Tsai, additional, Chao, Yu-Lin, additional, Dai, Ming-Ji, additional, Tain, Ra-Min, additional, Chien, Heng-Chieh, additional, Chien, Chun-Hsien, additional, Cheng, Ren-Shin, additional, Huang, Yu-Wei, additional, Lee, Yuan-Chang, additional, Hsiao, Zhi-Cheng, additional, Tsai, Wen-Li, additional, Chang, Pai-Cheng, additional, Fu, Huan-Chun, additional, Cheng, Yu-Mei, additional, Liao, Li-Ling, additional, Lo, Wei-Chung, additional, and Kao, Ming-Jer, additional

Published
2014
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8. Investigation of the process for glass interposer

Author

Lee, Ching-Kuan, primary, Chien, Chun-Hsien, additional, Chiang, Chia-Wen, additional, Shen, Wen-Wei, additional, Fu, Huan-Chun, additional, Lee, Yuan-Chang, additional, Tsai, Wen-Li, additional, Wang, Jen-Chun, additional, Chang, Pai-Cheng, additional, Zhan, Chau-Jie, additional, Lin, Yu-Min, additional, Cheng, Ren-Shin, additional, Ko, Cheng-Ta, additional, Lo, Wei-Chung, additional, and Rachel, Yung-Jean Lu, additional

Published
2013
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9. Performance and process characteristic of glass interposer with through-glass-via(TGV)

Author

Chien, Chun-Hsien, primary, Yu, Hsun, additional, Lee, Ching-Kuan, additional, Lin, Yu-Min, additional, Cheng, Ren-Shin, additional, Zhan, Chau-Jie, additional, Chen, Peng-Shu, additional, Liu, Chang-Chih, additional, Hsu, Chao-Kai, additional, Chang, Hsiang-Hung, additional, Fu, Huan-Chun, additional, Lee, Yuan-Chang, additional, Shen, Wen-Wei, additional, Ko, Cheng-Ta, additional, Lo, Wei-Chung, additional, and Lu, Yung Jean, additional

Published
2013
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10. Processing characteristics and reliability of embedded DDR2 memory chips

Author

Hung, Yin-Po, primary, Chang, Tao-Chih, additional, Lee, Ching-Kuan, additional, Lee, Yuan-Chang, additional, Chang, Jing-Yao, additional, Huang, Shin-Yi, additional, Hsu, Chao-Kai, additional, Li, Shu-Man, additional, Huang, Jui-Hsiung, additional, Leu, Fang-Jun, additional, Cheng, Ren-Shin, additional, Huang, Yu-Wei, additional, and Chen, Tai-Hong, additional

Published
2010
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