14 results on '"Lee, Yuan-Chang"'
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2. Desorption ionization of biomolecules on metals
3. Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLP
4. Reliability evaluation of glass interposer module
5. Backside-TSV process development and integration for 2∼3um small size TSV
6. The electrical characterizations of glass interposer for integrated reliability test
7. Low-cost TSH (through-silicon hole) interposers for 3D IC integration
8. Investigation of the process for glass interposer
9. Performance and process characteristic of glass interposer with through-glass-via(TGV)
10. Processing characteristics and reliability of embedded DDR2 memory chips
11. Chip Embedded Wafer Level Packaging Technology for Stacked RF-SiP Application
12. Thermal and Electrical Performance Enhancement with a Cost-Effective Packaging for High Speed Memory Chips
13. Interconnection of Flexible Electronic-Optical Circuit Board Module
14. Characterization of organic multi‐mode optical waveguides for electro‐optical printed circuit boards (EOPCB)
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