27 results on '"Lin, Han-wen"'
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2. Rheumatic diseases associated with autoimmune bullous dermatoses
3. Dupilumab facial dermatitis in atopic dermatitis patients ameliorated by topical crisaborole: An open‐label case series study.
4. Fabrication and characteristics of highly ⟨110⟩-oriented nanotwinned Au films
5. Immune Characteristics and HLA Associations of SARS-Cov-2 Vaccines-induced Delayed-Type Cutaneous Adverse Reactions
6. Effect of Sn Grain Orientation on Formation of Cu6Sn5 Intermetallic Compound Under Current Stressing
7. Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on 〈1 1 1〉 oriented and nanotwinned Cu
8. Painful annular skin rash on both legs in a patient with rectal cancer
9. Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam
10. Unidirectional Growth of Microbumps on (111)-0riented and Nanotwinned Copper
11. Man With a Bleeding Wound on the Scalp
12. A VaFALCON neuro-fuzzy system for mining of incomplete construction databases
13. Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
14. Fabrication and characteristics of highly $$\langle {110} \rangle $$-oriented nanotwinned Au films
15. Effect of Sn Grain Orientation on Formation of Cu6Sn5 Intermetallic Compound Under Current Stressing
16. Low-temperature and low-pressure direct copper-to-copper bonding by highly (111)-oriented nanotwinned Cu
17. Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu
18. Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging
19. Extremely anisotropic single-crystal growth in nanotwinned copper
20. Effect of grain orientations of Cu seed layers on the growth of <111>-oriented nanotwinned Cu
21. Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces
22. Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces.
23. Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging.
24. Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on 〈111〉 oriented and nanotwinned Cu
25. Thermomigration of Ti in flip-chip solder joints
26. A Neuro Fuzzy System for Knowledge Discovery of Incomplete Construction Data
27. Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on 〈111〉 oriented and nanotwinned Cu.
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