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Atomic force microscopy (AFM) was used to investigate the morphology and rigidity of the opportunistic pathogenic yeast, Candida albicans ATCC 10231, during its attachment to surfaces of three levels of nanoscale surface roughness. Non-polished titanium (npTi), polished titanium (pTi), and glass with respective average surface roughness ( S a ) values of 389 nm, 14 nm, and 2 nm, kurtosis ( S kur ) values of 4, 16, and 4, and skewness ( S skw ) values of 1, 4, and 1 were used as representative examples of each type of nanoarchitecture. Thus, npTi and glass surfaces exhibited similar S skw and S kur values but highly disparate S a . C. albicans cells that had attached to the pTi surfaces exhibited a twofold increase in rigidity of 364 kPa compared to those yeast cells attached to the surfaces of npTi (164 kPa) and glass (185 kPa). The increased rigidity of the C. albicans cells on pTi was accompanied by a distinct round morphology, condensed F-actin distribution, lack of cortical actin patches, and the negligible production of cell-associated polymeric substances; however, an elevated production of loose extracellular polymeric substances (EPS) was observed. The differences in the physical response of C. albicans cells attached to the three surfaces suggested that the surface nanoarchitecture (characterized by skewness and kurtosis), rather than average surface roughness, could directly influence the rigidity of the C. albicans cells. This work contributes to the next-generation design of antifungal surfaces by exploiting surface architecture to control the extent of biofilm formation undertaken by yeast pathogens and highlights the importance of performing a detailed surface roughness characterization in order to identify and discriminate between the surface characteristics that may influence the extent of cell attachment and the subsequent behavior of the attached cells.

Nanostructured mechano-bactericidal surfaces represent a promising technology to prevent the incidence of microbial contamination on a variety of surfaces and to avoid bacterial infection, particularly with antibiotic resistant strains. In this work, a regular array of silicon nanopillars of 380 nm height and 35 nm diameter was used to study the release of bacterial cell debris off the surface, following inactivation of the cell due to nanostructure-induced rupture. It was confirmed that substantial bactericidal activity was achieved against Gram-negative Pseudomonas aeruginosa (85% non-viable cells) and only modest antibacterial activity towards Staphylococcus aureus (8% non-viable cells), as estimated by measuring the proportions of viable and non-viable cells via fluorescence imaging. In situ time-lapse AFM scans of the bacteria-nanopillar interface confirmed the removal rate of the dead P. aeruginosa cells from the surface to be approximately 19 minutes per cell, and approximately 11 minutes per cell for dead S. aureus cells. These results highlight that the killing and dead cell detachment cycle for bacteria on these substrata are dependant on the bacterial species and the surface architecture studied and will vary when these two parameters are altered. The outcomes of this work will enhance the current understanding of antibacterial nanostructures, and impact upon the development and implementation of next-generation implants and medical devices.

A range of chitosan-based biomaterials have recently been used to perform sutureless, laser-activated tissue repair. Laser-activation has the advantage of bonding to tissue through a non-contact, aseptic mechanism. Chitosan adhesive films have also been shown to adhere to sheep intestine strongly without any chemical modification to chitosan. In this study, we continue to investigate chitosan adhesive films and explore the impact on the tissue repair strength and tensile strength characteristics of four types of adhesive film based on chitosan with different molecular weight and degree of deacetylation. Results showed that adhesives based on chitosan with medium molecular weight achieved the highest bonding strength, tensile strength and E-modulus when compared to the other adhesives., (Copyright © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.)