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4. Unsupervised Paper2Slides Generation

Author

Lu, Zehao and Lu, Zehao

Abstract

Although presentations are an excellent medium for sharing academic opinions and ideas, there has been a scarcity of research into automating the "paper to slides" generation task, and a lack of publicly available datasets. In response, we propose an inventive optimization framework based on reconstruction loss, harnessing cutting-edge Large Language Models (LLMs) and unsupervised learning. This approach facilitates the creation of high-quality slide decks from scientific papers, offering heightened adaptability and flexibility. Our evaluation results provide empirical evidence of our model’s superior performance in comparison to baseline models.

Published
2023

6. Effect of leveling agent on copper electroplating of through hole on aluminum-based copper clad laminate.

Author

ZENG Xiangjian, LU Zehao, YUAN Zhenjie, FU Liuyu, TAN Jie, HUANG Lixin, PAN Zhanchang, HU Guanghui, ZHANG Yafeng, SHI Shikun, and XIA Guowei

Subjects
THERMAL shock, ELECTROPLATING, PLATING baths, COPPER, POLYETHYLENE glycol, CETYLTRIMETHYLAMMONIUM bromide, LAMINATED materials, METAL finishing
Abstract

Different organic compounds i.e. cetyltrimethylammonium bromide (CTAB), polyvinyl pyrrolidone (PVP), and 2-mercapto-5-methyl-1,3,4-thiadiazole (MMTD) were added as a leveling agent respectively to a plating bath containing CuSO4⋅5H2O 100 g/L, concentrated sulfuric acid 200 g/L, Cl- 60 mg/L, polyethylene glycol (PEG-6000) 200 mg/L, and sodium polydithiodipropane sulfonate (SPS) 10 mg/L. The effects of different leveling agents on copper electroplating of through hole were studied by chronopotentiometry and thermal shock test. The results showed that the electrodeposition of copper could be inhibited at a certain extent when adding 2-4 mg/L of CTAB or MMTD to the bath, and the throwing power met the requirement of not lower than 80%. Only the copper coating prepared with 4 mg/L of MMTD as leveling agent featured qualified thermal shock resistance. [ABSTRACT FROM AUTHOR]

Published
2022
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