100 results on '"Manna, Antonio"'
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2. Reply to Taylor et al. Comment on “Manna et al. SARS-CoV-2 Inactivation in Aerosol by Means of Radiated Microwaves. Viruses 2023, 15, 1443”
3. Integrated Photonics for multi-channel RF scanning receivers
4. Direct Cu to Cu Bonding and Alternative Bonding Techniques in 3D Packaging
5. SARS-CoV-2 Inactivation in Aerosol by Means of Radiated Microwaves
6. Direct Cu to Cu Bonding and Other Alternative Bonding Techniques in 3D Packaging
7. A 18-40 GHz Full Connected Vivaldi Antenna Array
8. Miniaturized Supershaped Sinuous Antennas for UWB Applications
9. Direct Cu to Cu Bonding and Other Alternative Bonding Techniques in 3D Packaging
10. Efficiency Enhancement for an S-Band Axial Vircator Using 5-Stage Two-Step Tapered Radiators
11. Machine Learning Based Fully Digital UWB Antenna for Direction Finding Systems
12. Sinuous Antenna for UWB Radar Applications
13. UWB Supershaped Dielectric Lens for Beam Control
14. Compact Antenna for Optimized Platform Installations
15. Vircator Technologies Comparison and Novel Anode Analysis
16. Planar and Low-consumption Switchable Filter Banks with Tunable Passband and Stopband Responses
17. Compact Interferometric Antenna Array for UWB Direction Finding
18. Mechanical Design and Manufacturing of Signal Interception Antenna in Composite Material for Naval Application
19. Novel Miniaturized Sinuous Antenna for UWB Applications
20. UWB Multifunction Antennas
21. An Integrated Radar and Communication Antenna System for Single Mast Platforms
22. Non-Conventional Cavity Backed Sinuous Antenna for UWB Radar Applications
23. Fine Pitch Micro-Bump Interconnections for Advanced 3D Chip Stacking
24. Compact AESA for Airborne Self-Protection and Close-Support Jammers
25. Torsten B. Moeller and Emil Reif (eds): Pocket Atlas of Sectional Anatomy, Computed Tomography and Magnetic Resonance Imaging, 4th edn. Vol. I: Head and Neck; Vol. II: Thorax, Heart, Abdomen and Pelvis: Thieme, Stuttgart 2014, ISBN: 978-3-13-125504-4 (Vol. I), 978-3-13-125604-1 (Vol. II)
26. Compact Shaped Antennas for Wide-Band Radiogoniometry
27. An Innovative UWB Connected Array for Multifunctional Applications
28. A Novel Integrated RESM-CESM Antenna for Naval Platforms
29. Dual-Band Antenna Array With Superdirective Elements for Short-Distance Ballistic Tracking
30. Mezzo millennio di storia romana a Casal Bernocchi-Malafede. I risultati degli scavi 2015
31. Indagini archeologiche tra il Canale Trasverso e l’Episcopio. Osservazioni preliminari sulle fasi post-classiche di Porto
32. Jasna Mihailovic, Stanley J. Goldsmith and Ronan P. Killeen (eds) FDG PET/CT in Clinical Oncology: Case Based Approach with Teaching Points: Springer-Verlag , Berlin-Heidelberg, 2012. ISBN: 978-3-642-29865-3
33. Gallium arsenide 0.5–18 GHz antenna front‐end with integrated limiter and differential to single ended low‐noise amplifier
34. Experimental Investigations of a Novel Lightweight Blade Antenna for UAV Applications [Antenna Applications Corner]
35. ESD protection design in active-lite interposer for 2.5 and 3D systems-in-package
36. Dual-polarization DF Array for airborne SIGINT in VHF / UHF bands
37. Dual-polarization DF array for airborne SIGINT in VHF/UHF bands
38. Design and Realization of 3 dB hybrid stripline coupler in 0.5 – 18.0 GHz
39. A small lightweight wideband printed dipole for UAV applications
40. Measurements and Analysis of Substrate Noise Coupling in TSV-Based 3-D Integrated Circuits
41. Via-middle through-silicon via with integrated airgap to zero TSV-induced stress impact on device performance
42. Thermo mechanical challenges for processing and packaging stacked ultrathin wafers
43. Small Pitch Micro-Bumping and Experimental Investigation for Under Filling 3D Stacking
44. Stacking Aspects in the View of Scaling.
45. Use of Wafer Applied Underfill for 3D Stacking
46. 3D technology roadmap and status
47. The Road towards Fully Hybrid CMOS Imager Sensors.
48. Use of Wafer Applied Underfill for 3D Stacking
49. An IC-centric biocompatible chip encapsulation fabrication process
50. Biocompatibility assessment of advanced wafer-level based chip encapsulation
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