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2. Thermal Noise Measurements in a Reverberation Chamber

6. A 1.3 GHz, High Voltage Mesoband Dipole Antenna for IEMI Testing

7. A 150 MHz, High Voltage Mesoband Dipole Antenna for IEMI Testing

8. An Overview of the New IEEE P2716 Guide to Board Level Shielding

9. Numerical and theoretical analysis of stochastic electromagnetic fields coupling to a printed circuit board trace

10. A statistical model to estimate an upper bound on the probability of failure of a system installed on an irradiated vehicle

11. Radio frequency electromagnetic fields in large conducting enclosures: effects of apertures and human bodies on propagation and field-statistics

12. A fast multiple mode intermediate level circuit model for the prediction of shielding effectiveness of a rectangular box containing a rectangular aperture

14. Shielding metrics

20. Measured average absorption cross-sections of printed circuit boards from 2 to 20 GHz

21. Experimental characterization of the response of an electrical and communication raceway to IEMI

22. On the measureable range of absorption cross-section in a reverberation chamber

26. Rapid and accurate broadband absorption cross-section measurement of human bodies in a reverberation chamber

27. Model of the Electromagnetic Fields Inside a Cuboidal Enclosure Populated with Conducting Planes or Printed Circuit Boards

29. Broadband Measurement of Absorption Cross-Section of the Human Body in a Reverberation Chamber

30. An Experimental Investigation of the use of Q-Factor to Determine the Shielding Effectiveness of Electrically Large Equipment Enclosures with Apertures

32. Q: Re-running halyards

41. Characterising borehole radio antenna performance using finite-difference time-domain modelling.

42. PHYSICISTS CAN FILL THE SKILLS GAP.

43. Investigation on shielding effectiveness of reverberant enclosures with contents

44. Shielding effectiveness of reverberant enclosures containing printed circuit boards

45. TLM Model for the Lightning Transient Analysis of the GSM Base Station

46. Response surface methodology for modelling lead frame of IC packages

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