97 results on '"Moon, Seok-Hwan"'
Search Results
2. Process window of simultaneous transfer and bonding materials using laser‐assisted bonding for mini‐ and micro‐LED display panel packaging.
3. Application of aluminum flat heat pipe for dry cooling near the hot spot of a radar array with a multiscale structure
4. Maximum Power-Point Tracking Control Using Perturb and Observe Algorithm for Tidal Current Generation System
5. Effective algorithms of a power converter for tidal current power generation system
6. The carbon wire bundle’s constructing as a capillary wick in the flat thin heat pipe
7. A single unit cooling fins aluminum flat heat pipe for 100 W socket type COB LED lamp
8. Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration
9. Process window of simultaneous transfer and bonding materials using laser‐assisted bonding for mini‐ and micro‐LED display panel packaging
10. Effective algorithms of a power converter for tidal current power generation system
11. Maximum Power-Point Tracking Control Using Perturb and Observe Algorithm for Tidal Current Generation System
12. IMPROVEMENT IN THE DIRECTIONAL THERMAL CONDUCTIVITY OF A THIN HEAT SPREADER BASED ON A COMPOSITE MATERIAL SHEET FOR ELECTRONIC COOLING
13. Diffuse pleural thickening with nodularity in a healthy young woman
14. Real-Time Aperiodic Tasks Scheduling on Distributed Automotive Systems
15. Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era
16. A sensitivity study of size parameters in a twin-type rolling piston compressor
17. Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology
18. Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive
19. Analysis of Smartphone Early Adopters’ Satisfaction and Recommendation Intention Using Technology Acceptance Model
20. Collective laser‐assisted bonding process for 3D TSV integration with NCP
21. Empirical Analysis of Service Quality of Mobile App Based on O2O: Focused on Delivery App
22. 59‐5: Simultaneous Transfer and Bonding (SITRAB) Process for Mini‐LED Display
23. A Study on the Quality Perception of Halal Mart Service through Kano Model and Timko’s Customer Satisfaction Coefficient
24. Prediction of Entrepreneurial Intentions of Korean and Chinese University Students using Theory of Planned Behavior Expanded with Propensity to Plan and Self-Construal
25. Micro Capillary Pumped Loop for Electronic Cooling
26. Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology
27. Laser-Assisted Bonding (LAB), Its Bonding Materials, and Their Applications
28. Maximum Power-Point Tracking Control Using Perturb and Observe Algorithm for Tidal Current Generation System
29. Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration
30. Experimental study on the thermal performance of micro-heat pipe with cross-section of polygon
31. Work flow control in the flexible flow line
32. Analysis of Smartphone Early Adopters’ Satisfaction and Recommendation Intention Using Technology Acceptance Model
33. Development of Thinned Aluminum Flat Heat Pipe Through Inclined Wall and Press Process
34. Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology
35. Collective laser‐assisted bonding process for 3D TSV integration with NCP
36. Improving thermal performance of miniature heat pipe for notebook PC cooling
37. Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate
38. A SOLUTION OF ALUMINUM FLAT HEAT PIPE FOR DRY COOLING THE LADAR ARRAY
39. Silica filler content in NCP and its effects on the reliability of 3D TSV Multi-Stack under thermal shock test
40. PREFACE: SELECTED PAPERS FROM THE JOINT 18TH INTERNATIONAL HEAT PIPE CONFERENCE AND THE 12TH INTERNATIONAL HEAT PIPE SYMPOSIUM
41. Correction to “Development of a 20-Pole–24-Slot SPMSM With Consequent Pole Rotor for In-Wheel Direct Drive” [Jan 16 302-309]
42. Development of the Structure for Enhancing Capillary Force of the Thin Flat Heat Pipe Based on Extrusion Fabrication
43. Erratum: Correction of Figure. Analysis and Experimental Characterization of Low Speed Direct Drive Fractional Slot Concentrated Winding Surface Permanent Magnet Synchronous Motor with Consequent Pole Rotor
44. Adaptive PLL method using recursive least square algorithm
45. On-line compensation of magnetic position sensor using recursive least square method
46. Characterization of transmission lines with through-silicon-vias and bump joints on high-resistivity Si interposers for RF three-dimensional modules
47. Thermal and Electrical Designs of RF 3D Module Based on Si Interposers with Redundant TSVs
48. Empirical Evaluation of Tidal Current Generation System at Ul-Dol-Mok in Jin-do
49. Development of a 20-Pole–24-Slot SPMSM With Consequent Pole Rotor for In-Wheel Direct Drive
50. Analysis and Experimental Characterization of Low Speed Direct Drive Fractional Slot Concentrated Winding Surface Permanent Magnet Synchronous Motor with Consequent Pole Rotor
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.