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In this paper, the impact of small additions of indium (In), nickel (Ni), and Titanium dioxide nanoparticles (TiO2 NPs) in the microstructure and characterization of eutectic Sn–0.7 Cu (SC07)-based solder were investigated. The third element In, Ni, or TiO2 NPs were added in varying amounts 0.4 or 0.8 wt% to SC07 alloy by replacing an equal amount of Sn for each addition. Structural analysis of the investigated samples showed that the addition of Ni or In modified the eutectic composition, leading to the appearance of primary phases (Cu6Sn5) followed by the formation of intermetallic compounds (IMCs) (Cu, Ni)6Sn5 and Cu6(Sn, In)5. However, addition of TiO2 NPs did not lead to formation of any new IMCs but refine β-Sn dendrites grains with a decrease in the volume fraction of Cu6Sn5 IMC. The crystallite size, lattice strain, and dislocation density of the SC07 solder alloy were improved in terms of third addition. The results indicated that the smallest crystallite size for SC07–0.8In associated with largest lattice strain and highest dislocation density. Microhardness tests were performed for all samples at room temperature. The results illustrate the enhancement indentation creep resistance of SC07 reinforced solder, which inherently correlates to the microstructure refinement and the formation of intermetallic phases (Cu, Ni)6Sn5 and Cu6(Sn, In)5 with higher hardness values. The obtained stress exponent values are in the range 9.26–11.46 for all tested alloys which close to that creep mechanisms associated with dislocation movement such as dislocation creep are predominant. Thus, we conclude that the greatest value of stress exponent for SC07–0.8In (10.9–11.46) at different loads suggested to be more resistant to indentation creep which improves the mechanical strength compared to other solders. [ABSTRACT FROM AUTHOR]

Accepted by: Aris Syntetos Launched in a post pandemic world primed for technological solutions, Gen AI marked the beginning of a transformational period. Uses, norms, standards and values embedded in artificial intelligence (AI) technology are evolving at a dizzying pace and are in flux. The current period—termed 'the Inter-AI Period'—presents an opportunity for researchers in management mathematics to shape an AI-enabled future. This window of opportunity will be short, after which mathematical principles and decision processes embedded in AI algorithms will harden. Technological evolution will certainly continue thereafter. But the views, norms, practices and strategies would have been embedded in the technology. It is up to researchers to act now to shape an AI-enabled future—one that harnesses the powers of AI but with guardrails to protect users and humanity. This invited essay is based on research involving interviews of dozens of business leaders and scholars and is intended as a call to action for researchers to grasp the gravity of this period and act now. [ABSTRACT FROM AUTHOR]

Our research reveals the continued and evolving role of the human factor in decision making in digitalized retail supply chains. We compare managerial roles in a pre‐ and post‐COVID era through conducting in‐depth interviews of 25 executives spanning the retail supply chain ecosystem. We use grounded theory to develop four main contributions. First, we find that the involvement of managerial judgment is found to be progressively greater moving up the retail supply chain, away from the customer and the demand signal. Second, integration of analytics and judgment is now the primary method of decision making, and we identify elements needed for success. Third, we develop an essential framework for a successful integration process. Fourth, we isolate the necessary components of a successful process for analytics/artificial intelligence (AI) implementation. Our paper offers important insights into how analytics and AI are—and should be used—in judgment and decision making and opportunities for researchers to understand the changing role of the human factor in digitalized retail supply chains. [ABSTRACT FROM AUTHOR]