203 results on '"Ndip, Ivan"'
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2. Analysis of the influences of PCB process tolerances and assembly tolerances on 60 GHz radar sensor for Radar toolkit
3. Flip-Chip-Based Dual-Polarized Antenna-on-Package Arrays for 5G mmWave Modules.
4. RF Packaging and Design for Development of High Performance 5G mmWave Modules
5. Wideband THz Yagi-Uda Bond Wire Antennas
6. 3D Comform Radar System for Detection of Motion and Falls in Spatial Application
7. RF models for Through SiC Vias for Highly Integrated Interposer Technology
8. Dual-Band Dual-Polarized Antennas for 5G mmWave Base Stations.
9. A Comparative Analysis of Two Dielectric Extraction Methods of a PCB Material for D-Band Applications
10. Mold based D-band slotted SIW bandpass filter
11. Design, Fabrication and Measurement of FOWLP-based Series-Fed Antennas for 6G D-Band MIMO Applications
12. Wide Band Dual Polarized Antenna Array for 5G mmWave based massive MIMO Base Station Applications
13. Sub-TeraHertz Modular Array Layout Optimization Under Fabrication Constraints
14. Design and Measurement of Interconnects in Fan-Out Wafer-Level Packaging (FOWLP) for mm-Wave Applications up to 100 GHz
15. Modeling and Measurement of Double Stacked Microvia in Antenna-in-Package Module for 5G mmWave Applications
16. Compact Wideband Antenna-in-Package Based on PCB Technology for 39 GHz 5G mmWave Applications
17. Temperature Dependent RF Characterization of Thin-Film Polyimide for 5G mmWave Antenna-in-Package Modules
18. Development of innovative substrate and embedding technologies for high frequency applications
19. Development of a 60GHz MIMO Radar Packaging Concept
20. Split-rings for heterogeneous integration of mm-Wave systems
21. MAC Layer Beamforming: Rate Loss due to Beam Cusping
22. Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach
23. The Impact of Ageing on the Dielectric Properties of Laminates for 79 GHz Automotive Radar
24. Thin Glass Characterization in the Radio Frequency Range
25. Influence of Ball Size and Geometry on the Reliability and RF Performance of mmWave System-in-Package: A Simulation Approach
26. RF Modeling and Measurement of a Novel Aperture-Coupled Hybrid Glass-Silicon 5G Antenna Array
27. High Quality Integrated Inductor in Fan-out Wafer-Level Packaging Technology for mm-Wave Applications
28. Performance Simulation of a 5G Hybrid Beamforming Millimeter-Wave System
29. Fork-Coupled Resonators for Characterization of Mold Material for 5G Applications
30. Dual-Band 5G Antenna Array in Fan-Out Wafer-Level Packaging (FOWLP) Technology
31. EBG Common-Mode Filter Design Using Uncoupled Coplanar Waveguide to Microstrip Transitions
32. A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems
33. Fan-out Wafer Level Packaging of GaN Components for RF Applications
34. Development of a Glass Technology Based 79 GHz MIMO Radar Front-End Module for Autonomous Driving
35. Quasi-Half Loop Bond Wire Antennas for Emerging Wireless Communication and Radar Sensor Systems
36. How Relevant is Packaging for 5G?
37. High Density Flex and Thin Chip Embedding Technology for Polymeric Interposer and Sensor Packaging Applications
38. Characterization of bump arrays at RF/microwave frequencies
39. Integration specifications
40. Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines
41. Closed-Form Multipole Debye Model for Time-Domain Modeling of Lossy Dielectrics
42. High-Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications
43. K-band SATCOM Receiver Modules: System Design, Analysis and Test using the M3-Approach
44. On the Radiation Characteristics of Full-Loop, Half-Loop, and Quasi-Half-Loop Bond Wire Antennas
45. Systematic Design of Ka-band Transmitter Modules using the M3-Approach
46. Integration of a K-Band Receiver Front-End Using a Copper Core Printed Circuit Board
47. Mixed-Port Hybrid Parameters for High-Speed Differential Lines
48. Can Bond Wires really be used as Antennas?
49. Roles and Requirements of Electronic Packaging in 5G
50. Differential-Line Characterization Using Mixed-Port Scattering Parameters
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