22 results on '"Niu, Xin-Huan"'
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2. Edge cracking behavior of Y2O3 films based on the stress intensity factor
3. Method of surface treatment on sapphire substrate
4. Slurry and processing technique of CLBO crystal
5. Effect of surfactant on removal of particle contamination on Si wafers in ULSI
6. Dislocation of Cz-sapphire substrate for GaN growth by chemical etching method
7. Influence of Nano Abrasive on Chemical Mechanical Ultra-Precision Machining of Sapphire Substrate Surfaces
8. The Study of Stability of Tungsten Plug CMP Slurry for IC Multilevel Interconnect
9. The Application of New Reagent in the Copper Wiring CMP
10. Effect of different reagents on stability of Alkalinity silica sol
11. Study on chemical mechanical ultra precision process technology of Aluminum Interconnected Line for ULSI
12. Defectivity Reduction in the Silicon Tough Polishing with Polyamine and Nonions Surfactant Additives
13. A Study of a New Cleaning Agent for Post-CMP Pattern Wafer
14. Effect of FA/O Chelating Agent on Copper Ion Removing on Silicon Surface
15. Chemical Mechanical Planarization of Cu Pattern Wafer Based Alkaline Slurry in GLSI with R(NH2)n as Complexing Agent
16. Ultra Precision Machining Technique of InSb Substrate Material for Detector Devices
17. The Important Role of Oxidant in Copper Interconnection Chemical Mechanical Polishing for GLSI
18. High Precision Finishing Technique of Sapphire Substrate Surface for Photoconducting Device
19. Growth and Fundamental Properties of SiGe Single Crystal
20. Analyses of CMP Mechanism of NiP Substrate of Computer Hard-Disk with Alkali Slurry
21. Study on the lapping slurry for ULSI silicon substrate preparation
22. Chemical Mechanical Planarization of Cu Pattern Wafer Based Alkaline Slurry in GLSI with R(NH2)n as Complexing Agent
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