23 results on '"Noh, Seungjun"'
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2. Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module
3. The Ʃ3 twin dependence of thermo-mechanical fatigue of a polycrystalline high-purity Cu film
4. Large-area die-attachment by silver stress migration bonding for power device applications
5. Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver
6. Bonding technology based on solid porous Ag for large area chips
7. Improvement of the Bond Strength of Ag Sinter-Joining on Electroless Ni/Au Plated Substrate by a One-Step Preheating Treatment
8. Printed wire interconnection using Ag sinter paste for wide band gap power semiconductors
9. TLR3 Activation Stimulates Autophagy Gene Expression in Keratinocytes
10. A study on the acoustic energy harvesting with Helmholtz resonator and piezoelectric cantilevers
11. Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors
12. Improvement of the Bond Strength of Ag Sinter-Joining on Electroless Ni/Au Plated Substrate by a One-Step Preheating Treatment
13. Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules
14. Nearly perfect Ag joints prepared by Ag stress-migration-bonding (SMB) process
15. Thermostable porous Ag die-attach structure for high-temperature power devices
16. Bonding technology using cold-rolled Ag sheet in die-attachment applications
17. A nearly-perfect Ag joints prepared by novel Ag to Ag direct bonding
18. Heat-resistant die-attach with cold-rolled Ag sheet
19. Printed Wiring for High-Power Electric Devices by Using Ag-sinter paste
20. Thermal effect on material properties of sintered porous silver during high temperature ageing
21. Development of heat-resistant interconnections for wide bandgap semiconductor power modules
22. Heat-resistant die-attach with cold-rolled Ag sheet
23. Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni⁻P Layers for High-Temperature Applications of Power Device Modules.
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