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Inclusion of Si atoms to the growth surface during the molecular beam epitaxy of Ge and Sn to form a SiGeSn alloy was identified as a reactive surface species and as a means to compensate strain, which allowed for the subsequent growth of GeSn alloys with high Sn content. The development of a SiGeSn virtual substrate having a 15% Sn concentration and lattice parameter larger than 5.72 Å is demonstrated, using atomic force microscopy, x-ray reciprocal space mapping, and transmission electron microscopy, as a method for the direct growth of thick (>500 nm) fully relaxed GeSn alloys with greater than 10% Sn. This buffer layer enables the monolithic integration of GeSn with silicon for optoelectronic applications, as the SiGeSn virtual substrate allows for selective chemical etching of GeSn, which is important for device fabrication. [ABSTRACT FROM AUTHOR]

The infrared optical properties of thick GeSn films (>500 nm) having 10% Sn concentration and of SiGeSn layers, utilized for the growth of strain-relieved, direct-gap GeSn films by molecular beam epitaxy, are investigated. Two growth methods are used: a graded-growth structure and a stepped-growth structure that help us to illustrate the properties of the GeSn and SiGeSn layers. Interestingly, there can be strong absorption in SiGeSn films throughout the infrared. We observe an increase in infrared absorption with increasing Sn concentration up to 21% Sn and in films, where the Sn is held constant at 18%, with increasing Si concentration up to 30%. Cavity effects in the infrared transmission measurement of stepped-growth structures are observed and associated with reflections at growth interfaces. Si–Si bond formation is proposed to occur at high Si concentrations in SiGeSn films, and the bandgap in SiGeSn films appears to decrease with increasing Si and Sn concentrations. [ABSTRACT FROM AUTHOR]

The Sb concentration profile in an nBn photodetector containing an InAs/InAsSb type-II superlattice is collected and analyzed using atom probe tomography. A 3D reconstruction comprises the full composition of 31 periods. The Sb concentration profile is evaluated for the entire 31 period stack, as well as each individual period using segregation models from Muraki and Wood. Trends in the asymmetric Sb profile show a consistent non-negligible Sb concentration in the InAs layers and a lower Sb concentration in the InAsSb with respect to the target concentration. [ABSTRACT FROM AUTHOR]

We report on an investigation of dark current contributions from common microscale crystallographic defects in type-II InAs/GaInSb superlattice infrared PIN type photodiode structures grown on (100) GaSb substrates and have identified three general classifications. Defects on several wafers of varying design were examined from multiple perspectives to correlate electrical activity with structural properties, to develop the identification and classification scheme. Active defects were first identified by current density vs voltage (J-V) measurements and electron beam induced current (EBIC) scans of individual diodes with micrometer resolution. The EBIC scans were then correlated with plan-view optical and atomic force microscopy images, both before and after anisotropic etch-pit analysis using a newly developed etchant. The atomic scale structure of active and inactive defects was then compared using cross-sectional transmission electron microscopy (TEM) on vertical slices of defects extracted using focused ion beam milling. Analysis of the TEM images yielded important clues as to the structure and root causes of benign and active defects, in which only significant disruptions at the epi-substrate interface appear to play a key role in producing microscale defects that efficiently promote dark current. [ABSTRACT FROM AUTHOR]

The properties of reduced graphene oxide (GO) are reported from a non-chemical reduction method. Ultra-high vacuum annealing of GO films in the thickness of 1-80 nm was studied by XPS, AFM, UV-Vis-NIR, Raman and TEM to observe the controlled removal of oxygen. We observed the loss of hydroxyl (C-OH) at low temperatures (<600 °C) followed by the complete loss of carbonyls (C=O) and epoxy (C-O-C) species by 1200 °C. As oxygen was removed, we observed a decrease in the layer spacing between the GO sheets and a concurrent decrease in the film resistance. While the Raman spectroscopy showed no change with reduction, indicating no change in the overall defect density or the general structure of the GO, the transmission spectra showed a shift in the transmission minimum from 245 nm to 260 nm and a total decrease in transmission above 800 nm occurs as the films visibly darken. TEM indicated that there is turbostratic stacking of the graphene layers as the reduction occurs, leading us to conclude that at a certain threshold of reduction the film properties are similar to epitaxial graphene growth on the C-face of SiC, but that a reduction gone too far results in a layer spacing equivalent to graphite. [ABSTRACT FROM AUTHOR]

We discuss the current performance of long-wavelength infrared photodetectors based on type-II superlattices, and the projected characteristics for diffusion-limited operation. For optimized architectures such as graded-gap and abrupt-heterojunction designs, the dark currents are strongly dominated by Shockley-Read (SR) rather than Auger processes. A factor of 10 improvement over the demonstrated SR lifetimes would lead to a factor of 4 lower dark current than state-of-the-art HgCdTe devices. [ABSTRACT FROM AUTHOR]