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1. Massive QTL analysis identifies pleiotropic genetic determinants for stress resistance, aroma formation, and ethanol, glycerol and isobutanol production in Saccharomyces cerevisiae

3. Characterization and Reliability Study of an Al-Doped HfO₂-Based High-Density 2.5-D MIMCAP

5. Reducing phenolic off-flavors through CRISPR-based gene editing of the FDC1 gene in Saccharomyces cerevisiae x Saccharomyces eubayanus hybrid lager beer yeasts.

7. TSV-assisted Hybrid FinFET CMOS - Silicon Photonics Technology for High Density Optical I/O

8. High-Speed TSV Integration in an Active Silicon Photonics Interposer Platform

9. Hybrid 14nm FinFET - Silicon Photonics Technology for Low-Power Tb/s/mm2 Optical I/O

16. Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers

18. New insights into charging in capacitive RF MEMS switches

22. Evolution, dispersion et complexification des métiers du social.

23. ESH Friendly Solvent for Stripping Positive and Negative Photoresists in 3D-Wafer Level Packaging and 3D-Stacked IC Applications

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