45 results on '"O’Mathuna, S.C."'
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2. Size and performance tradeoffs in micro-inductors for high frequency dc-dc conversion
3. PCB fluxgate current sensor with saturable inductor
4. Planar fluxgate current sensor integrated in printed circuit board
5. Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders
6. High-frequency micro-machined power inductors
7. Hysteresis modelling of high-frequency micro-transformers
8. A highly miniaturized wireless inertial sensor using a novel 3D flexible circuit
9. Effect of Gold Stud Bump Topology on Reliability of Flip Chip on Flex Interconnects
10. Simulation, design, development and test of antennas for wireless sensor network systems
11. Design and optimization of a lumped-element balun for a Zigbee wireless sensor node
12. Inductive Telemetry of Multiple Sensor Modules
13. Remote Electricity Actuation and Monitoring mote.
14. Technology roadmapping for Power Supply in Package (PSiP) and Power Supply on Chip (PwrSoC).
15. Design, Fabrication and Testing of Miniaturised Wireless Inertial Measurement Units (IMU).
16. The D-Systems Project - Wireless Sensor Networks for Car-Park Management.
17. Benchmark of power packaging for DC/DC and AC/DC converters
18. Miniaturised inertial measurement units IMU) for wireless sensor networks and novel display interfaces.
19. The development of a novel minaturized modular platform for wireless sensor networks.
20. An inertial measurement unit (IMU) for an autonomous wireless sensor network.
21. Impedance formulas for planar magnetic structures with spiral windings
22. State of the art of integrated power modules (IPMs) for 0.75 kW and 2 kW drive applications
23. Thermal characterization of vertical multichip modules MCM-V
24. Test chips, test systems, and thermal test data for multichip modules in the ESPRIT-APACHIP project
25. Acoustic Microscopy of Tape Automated Bonding (TAB) Tape for Interconnection and Packaging Applications
26. Test chips, test systems and thermal test data for multichip modules in the ESPRIT-APACHIP project.
27. Miniaturised inertial measurement units IMU) for wireless sensor networks and novel display interfaces
28. Characterisation of cooling curves for power device die attach using a transient cooling curve measurement
29. Characterisation of die attach for power devices using thermal impedance measurement practice and experiment
30. Impedance formulas for planar magnetic structures with spiral windings
31. StatPEP-current status of power electronic packaging for DC/DC and AC/DC converters
32. An inertial measurement unit (IMU) for an autonomous wireless sensor network
33. A miniaturised modular platform for wireless sensor networks
34. The development of a novel minaturized modular platform for wireless sensor networks
35. Inductive powering of sensor modules
36. Material characterisation and process development for miniaturised wireless sensor network module
37. Thermo-mechanical modelling and thermal performance characterisation of a 3D folded flex module.
38. Inductive powering of sensor modules.
39. Material characterisation and process development for miniaturised wireless sensor network module.
40. Development and characterisation of ultra thin autonomous modules for ambient system applications using 3D packaging techniques.
41. Electrical performance of micro-transformers for DC-DC converter applications.
42. Characterisation of cooling curves for power device die attach using a transient cooling curve measurement.
43. StatPEP-current status of power electronic packaging for DC/DC and AC/DC converters.
44. Characterisation of die attach for power devices using thermal impedance measurement practice and experiment.
45. Impedance formulas for planar magnetic structures with spiral windings.
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