19 results on '"OBENG, Y. S."'
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2. Comparative study on the effect of misalignment on bordered and borderless contacts
3. Broadband Spectroscopic Characterization of Hybrid Low-k Dielectric Thin Films for Micro- and Nanoelectronic Applications
4. (Invited) Broadband Spectroscopic Characterization of Electrically Active Defects in Dielectrics: Monitoring the in-Service Evolution of Dialectics in Integrated System
5. (Invited) Hardware Security to Mitigate Threats to Networked More-Than-Moore Sensors
6. (Invited) Characterization of Buried Interfaces with Scanning Probe Microscopes
7. Dielectric Spectroscopic Detection of Early Failures in 3-D Integrated Circuits
8. Temperature Dependence of Defect Evolution and Distribution in Thermally Cycled Cu-TSVs
9. (Invited) Microwave-Based Metrology Platform Development: Application of Broad-Band RF Metrology to Integrated Circuit Reliability Analyses
10. Measurement Science for "More-Than-Moore" Technology Reliability Assessments
11. (Invited) Impact of Thermal Stability of Isolation Liner on the Electrical Characteristics of TSVs
12. Planar TEM Analysis of Nanoindented Samples Using the Focused Ion Beam Lift-Out Technique
13. Asymmetrical Critical Current Density and Its Influence on Electromigration of Two-Level W-Plug Interconnection
14. New Dielectric Materials
15. Pitting of the Silicon Layer of Poly Buffered LOCOS Stack
16. ChemInform Abstract: Oxidant-Dependent Nonadiabatic Intervalence Transitions.
17. Nanoporous Ultralow Dielectric Constant Organosilicates Templated by Triblock Copolymers
18. Effect of silicon nitride capping layer on via electromigration and failure criterion methodology in multilevel interconnection
19. Impact of post via-etch cleans on mechanical reliability of W-plug vias
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