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An integrated array illuminator can be used not only as an optical power distributor for an array of guided-wave optic devices but also as a key element for guided-wave optical interconnections. We present a new design for an integrated-optic array illuminator with focusing waveguide diffractive doublet arrays. This integrated array illuminator allows independent optimizations of efficient and uniform optical power distribution and focusing performance. Furthermore, the device can be fabricated with all-optical lithographic technology and hence has the advantages of mass production with low cost.

The technical issues involved in applying vertical-cavity surface-emitting lasers (VCSEL's) to parallel optical interconnection systems are discussed from the viewpoint of their application to asynchronous transfer mode switching and parallel computer systems. We also discuss approaches to designing a VCSEL array structure for high-speed modulation and the effect of pixel-performance homogeneity on the transmission bandwidth and power consumption. We review monolithic and hybrid integration technologies for VCSEL-based smart-pixel arrays, and we estimate the maximum pixel number and input-output throughput allowed in a chip, considering the power consumption and pixel homogeneity. We show that a one-chip optoelectronic parallel processing system comprising more than 1000 processor elements is possible when smart-pixel arrays are fabricated under the 0.25-[[micro]meter] complementary metaloxide semiconductor design rule. OCIS codes: 140.3640, 200.4650, 220.4880

The design and implementation of a robust, scalable, and modular optical power supply spot-array generator for a modulator-based free-space optical backplane demonstrator is presented. Four arrays of 8 x 4 spots with 6.47-[[micro]meter] radii (at 1/[e.sup.2] points) pitched at 125 [[micro]meter] in the vertical direction and 250 [[micro]meter] in the horizontal were required to provide the light for the optical interconnect. Tight system tolerances demanded careful optical design, robust optomechanics, and effective alignment techniques. Issues such as spot-array generation, polarization, power efficiency, and power uniformity are discussed. Characterization results are presented. Key words: Optical power supply, spot-array generator, modulators, self-electro-optic devices, optomechanics, optical design, alignment, module, characterization.

A technique for mechanical bonding of epitaxial lift off films to the substrates achieves high-quality very-thin bonding layers at a temperature of 235 degrees centigrade. A multilayer structure of AuSn alloy achieves this thin layer bonding in an oxygen free environment. The technique can optimize layer sizes, bonding parameters, and diffusion barriers as per requirements. Surface analysis methods, such as optical microscopy, scanning electron microscopy, and energy dispersive X-ray analysis, are used to analyze the bonded specimens of the optoelectronic and microwave devices.