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The last decades have witnessed rapid growth of hydrogel bioelectronics. Traditional hydrogels face challenges when working under extreme conditions, leading to a loss of stabilities and functionalities. This review provides a systematic overview of hydrogels capable of working under extreme conditions, with a focus on their applications in bioelectronic systems. These hydrogels are summarized into categories of anti‐mechanical damage, anti‐detachment, anti‐swelling, anti‐freezing, and anti‐foreign body response. Strategies including material development and structural design that can endow the hydrogels with the above extreme properties are introduced. Finally, current challenges and new opportunities in developing extreme hydrogel bioelectronic devices and systems are discussed. [ABSTRACT FROM AUTHOR]