108 results on '"Paraschiv, Vasile"'
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2. LOW SUBSTRATE DAMAGE HIGH-K REMOVAL AFTER GATE PATTERNING
3. New Insights on Hemp Oil Enriched in Cannabidiol: Decarboxylation, Antioxidant Properties and In Vitro Anticancer Effect
4. A highly reliable 3-D integrated SBT ferroelectric capacitor enabling FeRAM ceiling
5. Fabrication challenges in integrating self-assembled block copolymer process in semiconductor devices
6. Cleaning Challenges of High-κ/Metal Gate Structures
7. Sulfonic acid-functionalized gold nanoparticles: A colloid-bound catalyst for soft lithographic application on self-assembled monolayers
8. Kinetic stabilities of double, tetra-, and hexarosette hydrogen-bonded assemblies
9. Nanostructures via noncovalent synthesis: 144 hydrogen bonds bring together 27 components
10. Galvanic Corrosion of Stacked Metal Gate Electrodes during Cleaning in HF Solutions
11. Selective Removal of High-k Dielectrics
12. Selective Wet Removal of Hf-Based Layers and Post-Dry Etch Residues in High-k and Metal Gate Stacks
13. HF Based Solutions for HfO2 Removal; Effect of pH and Temperature on HfO2: SiO2 Etch Selectivity
14. BCl3/N2 Plasma for Advanced non-Si Gate Patterning
15. Nb2O5 as waveguide material for visible light photonic integrated circuits (Conference Presentation)
16. (Invited) Challenges on Surface Conditioning in 3D Device Architectures: Triple-Gate FinFETs, Gate-All-Around Lateral and Vertical Nanowire FETs
17. (Invited) Vertical Nanowire FET Integration and Device Aspects
18. Junctionless Array with Ultrathin Poly\TiN Floating Gate and HfAlO Based Intergate Dielectric for Sub-15nm Planar NAND Flash
19. Thin-Silicon Injector (TSI): An All-Silicon Engineered Barrier, Highly Nonlinear Selector for High Density Resistive RAM Applications
20. Gate double patterning strategies for 10-nm node FinFET devices
21. Sulfonic acid-functionalized gold nanoparticles: A colloid-bound catalyst for soft lithographic application on self-assembled monolayers (Journal of the American Chemical Society (2003) 123, (4279-4284))
22. Influence of crystallographic orientation on etch properties of TiN
23. Molecular 'chaperones' guide the spontaneous formation of a 15-component hydrogen-bonded assembly
24. Functionalized Hydrogen-Bonded Assemblies as Templates for Metal-Containing Arrays of Nanorods
25. LOW SUBSTRATE DAMAGE HIGH-K REMOVAL AFTER GATE PATTERNING
26. Gate double patterning strategies for 10nm node FinFET devices
27. Thermal and plasma treatments for improved (sub-)1 nm equivalent oxide thickness planar and FinFET-based replacement metal gate high-k last devices and enabling a simplified scalable CMOS integration scheme
28. Double patterning with dual hard mask for 28-nm node devices and below
29. Low-Frequency-Noise-Based Oxide Trap Profiling in Replacement High-k/Metal-Gate pMOSFETs
30. STT MRAM patterning challenges
31. Double patterning with dual hard mask for 28nm node devices and below
32. (Invited) Challenges on Surface Conditioning in 3D Device Architectures: Triple-Gate FinFETs, Gate-All-Around Lateral and Vertical Nanowire FETs
33. Impact of metal etch residues on etch species density and uniformity
34. Interplay between Dry Etch and Wet Clean in Patterning La2O3/HfO2 Containing High-k/metal Gate Stacks
35. Work-Function Engineering for 32-nm-Node pMOS Devices: High-Performance TaCNO-Gated Films
36. Profile control of novel non-Si gates using BCl[sub 3]∕N[sub 2] plasma
37. Metal/High-K Interface Interactions Upon High Temperature Annealing - Are They Cause of Workfunction Changes
38. Influence of Ta(N) Metal Gate Microstructure on Its Etch Properties
39. Wet Etch Characteristics of Hafnium Silicate Layers
40. BCl3/N2 Plasma for Advanced non-Si Gate Patterning
41. Influence of oxide hard mask on profiles of sub-100 nm Si and SiGe gates
42. Effects of Voltage Cycling on Polarization and Reliability of 3D SBT Ferroelectric Capacitors Integrated in 0.18μm CMOS Technology.
43. Hydrogen-Bonded Assemblies as a Scaffold for Metal-Containing Nanostructures: From Zero to Two Dimensions
44. Complexation of phenolic guests by endo- and exo-hydrogen-bonded receptors
45. BCl3/N2 Plasma for Advanced non-Si Gate Patterning.
46. A Low-Power HKMG CMOS Platform Compatible With Dram Node 2× and Beyond.
47. Template polymerization of methacrylic acid along poly(N-acetyliminoethylene) in water. Influence of template architecture
48. Solution polymerization of vinyl monomers in the presence of poly(N-acetyliminoethylene) macroazoinitiators
49. Profile control of novel non-Si gates using BCl3/N2 plasma.
50. A Highly Reliable 3-D Integrated SBT Ferroelectric Capacitor Enabling FeRAM Scaling.
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