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Autohesion is a unique class of adhesion that enables the bonding of two identical surfaces by establishing intimate contact at interfaces. Creating intimacy between two identical surfaces poses a challenging task, often constrained by the presence of surface roughness and chemical heterogeneity. To surmount this challenge, we document a variety of autohesive traits in polypropylene-based meltblown nonwovens, accomplished through a facile, scalable, energy-efficient, and cost-effective ultrasonic bonding process. The mean work of autohesion for a single polypropylene bond, serving as a figure of merit, has been computed by extending the classical Johnson−Kendall−Roberts (JKR) theory by factoring in peel strength along with key fiber and structural parameters of nonwoven materials. Achieving a high figure of merit in ultrasonically bonded nonwovens hinges on the synergistic interplay of key process parameters, including static force, power, and welding speed, with the fiber and structural properties acting in concert. In this regard, peel-off force analysis has also been conducted on a series of twenty-seven ultrasonically bonded meltblown nonwovens prepared using a 33 full factorial design by systematically varying process parameters (static force, power, and welding speed) across three levels and extension rate. X-ray microcomputed tomography (microCT) analysis has been performed on select ultrasonically bonded nonwoven samples to discern their bulk characteristics. A broad spectrum of mean work of autohesion for a single polypropylene bond, ranging from 1.88 to 9.93 J/m², has been ascertained by modulating key process parameters.

Objective- This study aims to develop a novel framework for high-density surface electromyography (HD-sEMG) signal decomposition with superior decomposition yield and accuracy, especially for low-energy MUs. Methods- An iterative convolution kernel compensation-peel off (ICKC-P) framework is proposed, which consists of three steps: decomposition of the motor units (MUs) with relatively large energy by using the iterative convolution kernel compensation (ICKC) method and extraction of low-energy MUs with a Post-Processor and novel ‘peel-off’ strategy. Results- The performance of the proposed framework was evaluated by both simulated and experimental HD-sEMG signals. Our simulation results demonstrated that, with 120 simulated MUs, the proposed framework extracts more MUs compared to K-means convolutional kernel compensation (KmCKC) approach across six noise levels. And the proposed ‘peel-off’ strategy estimates more accurate MUAP waveforms at six noise levels than the ‘peel-off’ strategy proposed in the progressive FastICA peel-off (PFP) framework. For the experimental sEMG signals recorded from biceps brachii, an average of 16.1 ±3.4 MUs were identified from each contraction, while only 10.0 ± 2.8 MUs were acquired by the KmCKC method. Conclusion- The high yield and accuracy of MUs decomposed from simulated and experimental HD-sEMG signals demonstrate the superiority of the proposed framework in decomposing low-energy MUs compared to existing methods for HD-sEMG signal decomposition. Significance- The proposed framework enables us to construct a more representative motor unit pool, consequently enhancing our understanding pertaining to various neuropathological conditions and providing invaluable information for the diagnosis and treatment of neuromuscular disorders and motor neuron diseases.

New classes of ultrathin flexible and stretchable devices have changed the way modern electronics are designed to interact with their target systems. Though more and more novel technologies surface and steer the way we think about future electronics, there exists an unmet need in regards to optimizing the fabrication procedures for these devices so that large-scale industrial translation is realistic. This article presents an unconventional approach for facile microfabrication and processing of adhesive-peeled (AP) flexible sensors. By assembling AP sensors on a weakly-adhering substrate in an inverted fashion, we demonstrate a procedure with 50% reduced end-to-end processing time that achieves greater levels of fabrication yield. The methodology is used to demonstrate the fabrication of electrical and mechanical flexible and stretchable AP sensors that are peeled-off their carrier substrates by consumer adhesives. In using this approach, we outline the manner by which adhesion is maintained and buckling is reduced for gold film processing on polydimethylsiloxane substrates. In addition, we demonstrate the compatibility of our methodology with large-scale post-processing using a roll-to-roll approach.

Kulit merupakan lapisan pelindung tubuh sekaligus sebagai factor estetik yang berfungsi melindungi dari paparan zat asing dan sinar matahari. Beberapa masalah yang mungkin timbul dikulit antara lain penuaan dini dan timbulnya jerawat. Pemanfaatan bahan alam sebagai kosmetik semakin meningkat salah satunya adalah masker gel peel-off buah limpasu. Penelitian ini bertujuan untuk mengetahui aktivitas antibakteri formulasi ekstrak etanol buah limpasu. Formulasi sediaan dibuat dengan tiga konsentrasi ekstrak etanol buah limpasu (Baccaurea lanceolate) yaitu 4, 6 dan 8 gram. Formula diujikan pada bakteri E. coli. Rendemen ektrak buah limpasu sebesar 30,49 gram atau 7,81%. Hasil identifikasi pendahuluan ektrak etanol mengandung saponin dan flavonoid. Hasil uji antibakteri formula 1 sampai 3 memiliki zona hambat berturut-turut adalah 12, 53; 7,94 dan 9,97 mm dengan control positif tetrasiklin yang memiliki zona hambat rata-rata 28,87 mm. formula sediaan gel peel-off memiliki aktivitas antibakteri karena zona hambat rata-rata lebih dari 6 mm.

Background: Little has been reported in the literature regarding surgical treatment of posterior cruciate ligament (PCL) injuries in pediatric patients. Purpose/Hypothesis: The purpose was to evaluate presentation, injury pattern, outcomes, and complications of surgically managed PCL injuries in pediatric patients. It was hypothesized that pediatric patients would have good patient-reported outcomes and no significant radiographic changes or complications. Study Design: Systematic review; Level of evidence, 4. Methods: A literature search was performed using PubMed, Medline, EMBASE, Scopus, and Cochrane databases between 1975 and December 16, 2019. Search terms included "posterior cruciate ligament," "peel-off injury," "avulsion," "PCL," "pediatric," "skeletally immature," and "adolescent." Included were studies on pediatric patients with PCL injuries managed operatively. Exclusion criteria included case reports, studies not reporting clinical results, reviews, abstract or conference papers, or papers not in the English language. Quality assessment was performed on all included studies using the MINORS (Methodological Index for Non-Randomized Studies) criteria. Results: Four articles comprising 43 knees in 42 patients met the criteria and were included. Motor vehicle accidents were the most common mechanism of injury (39.5%; n = 17/43), followed by sports-related injuries (35%; n = 15/43). All studies commented on tear pattern, with the following distribution: 42% (n = 18/43) midsubstance tears, 37% (n = 16/43) tibial avulsions, and 21% (n = 9/43) femoral avulsions. Overall, good patient-reported outcomes (Knee injury and Osteoarthritis Outcome Score and Pediatric International Knee Documentation Committee, Tegner, and Lysholm scores) and return to activity, as well as satisfactory posterior stability (KT-1000 arthrometer, posterior drawer test, and kneeling radiographs) and range of motion, were reported. There was no significant leg-length discrepancy or angular deformity reported. Arthrofibrosis was reported in 7% of postoperative knees and was the most commonly reported complication. Osteoarthritis was reported in 21% (n = 9/43) of knees. The average MINORS score was 7 (range, 6-8) for noncomparative studies and 10 for comparative studies. Conclusion: Good patient-reported outcomes and return to activity can be obtained using repair or reconstruction. This evidence was limited by the quality of the included studies and overall small sample size; however, this review serves as a baseline for futures studies on PCL repair/reconstruction in pediatric patients. [ABSTRACT FROM AUTHOR]

Competing Interests: All the authors declare no conflict of interest.

New classes of ultrathin flexible and stretchable devices have changed the way modern electronics are designed to interact with their target systems. Though more and more novel technologies surface and steer the way we think about future electronics, there exists an unmet need in regards to optimizing the fabrication procedures for these devices so that large-scale industrial translation is realistic. This article presents an unconventional approach for facile microfabrication and processing of adhesive-peeled (AP) flexible sensors. By assembling AP sensors on a weakly-adhering substrate in an inverted fashion, we demonstrate a procedure with 50% reduced end-to-end processing time that achieves greater levels of fabrication yield. The methodology is used to demonstrate the fabrication of electrical and mechanical flexible and stretchable AP sensors that are peeled-off their carrier substrates by consumer adhesives. In using this approach, we outline the manner by which adhesion is maintained and buckling is reduced for gold film processing on polydimethylsiloxane substrates. In addition, we demonstrate the compatibility of our methodology with large-scale post-processing using a roll-to-roll approach.

Abstract: Electrical atomic force microscopy (AFM) methods require highly conductive tips with nanometer-scale spatial resolution. Si tips with metal (e.g. PtIr) and doped-diamond coatings are most commonly used. Metal coatings are however prone to rapid wear and diamond coatings are limited in conductivity and spatial resolution. Therefore, we have developed solid TiN tips with a pyramidal shape made by molding using anisotropic Si etching for defining an inverted pyramid and TiN sputtering for mold filling. The TiN tips are attached to Ni electroplated cantilevers. The probes are removed from the substrate using a dedicated peel-off step. The fabrication process is based on state-of-the-art 200-mm Si wafer technology. Probe evaluation in AFM shows a typical spatial resolution of about 8–15nm for these TiN tips. Using the hard TiN tips in scanning spreading resistance microscopy (SSRM) we demonstrate two-dimensional measurements of Ge doping staircase structures which could so far only be measured by doped diamond tips. Further measurements of carbon nanotube (CNT) interconnects and high-k metal gate stacks by conductive AFM (c-AFM) illustrate the potential of the TiN tips. This paper describes the probe concept, fabrication and evaluation in AFM. [Copyright &y& Elsevier]

Organic light-emitting diodes were fabricated on a glass-MgOx-Ag layered substrate and separated between Ag and MgOx interface, showing the bending properties. Adhesive force decreased from 18 to 1.4 gf/cm after insertion of the MgOx layer between the Ag and glass. The Ag-O component in Ag 3d 5/2 spectra and O-Ag (ionic bond) component in O 1s spectra increased as the MgOx layer was thickened. This supports that Ag oxidized to AgOx while the thickness of MgOx increased, resulting in a reduction of the adhesive forces of Ag layer. Therefore, it is concluded that a metal at the interface with a metal oxide is easily oxidized, reducing the adhesive forces and enabling the peel-off process. [ABSTRACT FROM PUBLISHER]

Elastomers and, in particular, polydimethylsiloxane (PDMS) are widely adopted as biocompatible mechanically compliant substrates for soft and flexible micro-nanosystems in medicine, biology, and engineering. However, several applications require such low thicknesses ( e.g ., <100 μm) that make peeling-off critical because very thin elastomers become delicate and tend to exhibit strong adhesion with carriers. Moreover, microfabrication techniques such as photolithography use solvents which swell PDMS, introducing complexity and possible contamination, thus limiting industrial scalability and preventing many biomedical applications. Here, we combine low-adhesion and rectangular carrier substrates, adhesive Kapton frames, micromilling-defined shadow masks, and adhesive-neutralizing paper frames for enabling fast, easy, green, contaminant-free, and scalable manufacturing of thin elastomer devices, with both simplified peeling and handling. The accurate alignment between the frame and shadow masks can be further facilitated by micromilled marking lines on the back side of the low-adhesion carrier. As a proof of concept, we show epidermal sensors on a 50 μm-thick PDMS substrate for measuring strain, the skin bioimpedance and the heart rate. The proposed approach paves the way to a straightforward, green, and scalable fabrication of contaminant-free thin devices on elastomers for a wide variety of applications.

Multielectrode arrays (MEAs) are devices for non-invasive electrophysiological measurements of cell populations. This paper describes a novel fabrication method of MEAs with a fully planar surface. The surface of the insulation layer and the surface of the electrodes were on one plane; we named this device the planar MEA (pMEA). The main advantage of the pMEA is that it allows uniform contact between the pMEA surface and a substrate for positioning of microfluidic channels or microprinting of a cell adhesive layer. The fabrication of the pMEA is based on a low adhesive Au sacrificial peel-off layer. In divergence from conventional MEAs with recessed electrodes, the electrodes of the pMEA lead across the sloped edge of the insulation layer. To make this, the profile of the edge of the insulation layer was measured and the impedance of the planar electrodes was characterized. The impedance of the pMEA was comparable with the impedance of conventional MEA electrodes. The pMEA was tested for patterning HL-1 cells with a combination of imprinting fibronectin and coating by antifouling poly (l-lysine)-graft-poly(ethylene glycol) (PLL-g-PEG). The HL-1 cells remained patterned even at full confluency and presented spontaneous and synchronous beating activity.

The performance of two-dimensional (2D) MoS2 devices depends largely on the quality of the MoS2 itself. Existing fabrication process for 2D MoS2 relies on lithography and etching. However, it is extremely difficult to achieve clean patterns without any contaminations or passivations. Here we report a peel-off pattering of MoS2 films on substrates based on a proper interface engineering. The peel-off process utilizes the strong adhesion between gold and MoS2 and removes the MoS2 film contact with gold directly, leading to clean MoS2 pattern generation without residuals. Significantly improved electrical performances including high mobility ∼17.1 ± 8.3 cm(2)/(V s) and on/off ratio ∼5.6 ± 3.6 × 10(6) were achieved. Such clean fabrication technique paves a way to high quality MoS2 devices for various electrical and optical applications.

A graphene (Gr) on a polyimide (PI) polymer film (Gr-PI film), obtained by a direct peel-off technique, is proposed and investigated. Thanks to its high transparency, electrical conductivity, mechanical strength, and chemical durability, the Gr-PI film is an ideal substrate for flexible electronic and optoelectronic devices, including transistors, light-emitting diodes, and plasmonic antennas. It is obtained using a straightforward method. After spin coating and curing a PI film on Gr previously grown on Cu, one can separate the Gr-PI film from the Cu foil thanks to the difference in the adhesive energy between the Gr-Cu and Gr-PI interfaces. The resulting Gr-PI film shows an average electrical sheet resistance ranging from 520 to 860 Ω/sq and a very high optical transmission (>90%), which have allowed the demonstration of a transparent heater. The surface morphology of the Gr-PI film follows that of the Cu foil, with the latter maintaining its surface properties and allowing in this way its reuse in subsequent chemical vapor deposition growth. The method can also be applied to patterned Gr, as is demonstrated for nanosize ribbons with a width of a few tens of nanometers.