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An aluminum oxide (AlOx)/silicon nitride (SiNy) dielectric stack was developed using an industrial plasma‐enhanced chemical vapor deposition (PECVD) system with low‐frequency (LF) plasma source for the surface passivation of undiffused textured p‐type crystalline silicon. The median recombination current density is 4.3 fA cm−2 as determined from photoconductance decay lifetime measurements and numerical device modeling. To the best of our knowledge, this is the first time to present a high‐quality LF‐PECVD AlOx/SiNy passivation stack on undiffused textured p‐type crystalline silicon wafers, which are cleaned with industrial processes using HF, HCl, and O3. The simulation agrees well with the measured effective carrier lifetime if the velocity parameters of 5.6 cm s−1 for holes and 803 cm s−1 for electrons are applied with a fixed negative charge density of −3 × 1012 cm−2. The process integration of developed AlOx/SiNy dielectric stack is successfully demonstrated by fabricating p‐type back junction solar cells featuring a poly‐Si‐based passivating contact at the cell rear side. As the best cell efficiency, we achieve 24.2% with an open‐circuit voltage of 725 mV on a M2‐sized Ga‐doped p‐type Czochralski‐grown Si wafer as independently confirmed by ISFH CalTeC. [ABSTRACT FROM AUTHOR]

Fast changing irradiation on vehicle-integrated photovoltaic (VIPV) modules may impose demanding requirements for maximum power point tracking (MPPT) to ensure high energy conversion efficiency. In this work, the results of simulations regarding the output and efficiency of an exemplary VIPV module under real-life irradiation conditions as measured with high time resolution are resulted. Herein, resistive as well as voltage source load is used as two idealized models of the MPPT. The simulations show that, in most cases, tracking with a resistive load at 1 Hz preserves above 90%rel of the convertible energy determined by the cell performances under given irradiance levels. With a voltage source load, these values do not undercut 97%rel at 0.1 Hz. Herein, it is also found that partial shading across the exemplary series connected module can reduce the converted energy in the range of 5-10%rel in relation to complete negligence of this effect. [ABSTRACT FROM AUTHOR]

Polysilicon-on-oxide (POLO) passivating contacts and interdigitated back-contact (IBC) cell technologies have recently attracted a lot of interest as candidates for the implementation in the next generation of solar cells. An IBC cell with POLO junctions for both polarities − a POLO2-IBC cell − has to electrically isolate the highly defective p+ and n+ poly-Si regions on the rear side of the cell to avoid parasitic recombination. Inserting an initially undoped, intrinsic (i) region between the p+ and n+ poly-Si regions was demonstrated to successfully prevent the parasitic recombination in the transition region of ISFH's 26.1%-efficient POLO2-IBC cell. In order to further improve the conversion efficiency towards 27%, we apply hydrogen-donating dielectric layer stacks to the p+-(i)-n+ POLO interdigitating rear side to enhance the passivation quality of the POLO junctions. We indeed show a significant improvement of POLO junctions on symmetrical full-area homogenously doped reference samples, but when we apply a hydrogen-donating layer stack on the p+-(i)-n+ POLO interdigitating rear side, we observe a strong degradation in the performance of the POLO2-IBC cell. We attribute this to the formation of a conductive channel between the p+ and n+ poly-Si regions due to the strong negative charge density of the hydrogen-donating layer stack.

The aim of this work is to demonstrate the maturity of the TOPCon technology by conducting a round-robin on symmetrically processed lifetime samples in the leading European PV institutes EPFL, ISC, CEA-INES, ISFH, IMEC and Fraunhofer ISE within the H2020 funded project called HighLite. For all layers, dark saturation current-densities ranging between 2 and 10 fA/cm2 can be reported. Simultaneously, no metal induced recombination for the two lower sintering temperatures have been observed pointing towards a true passivated contact. Furthermore, contact resistivities below 10 mΩcm2 have been achieved. It seems that the industrial passivating contact matured to a fully passivated and conducting contact enabling full efficiency potential. The fact that this can be realized using either PECVD or LPCVD from various manufacturer is expected to drive costs down and contribute to the increased adoption of the TOPCon technology.

In recent years, poly-Si based passivated contacts elevated the conversion efficiencies of crystalline Si solar cells to levels of 26%abs due to their outstanding electrical surface passivation performance and current transport characteristics. A major associated challenge, however, is the large parasitic light absorption within the doped poly-Si, regardless if the contacts are applied on the front and/or on the rear side of the solar cell. It, therefore, might be beneficial to confine the passivated contacts to local regions underneath the metal contacts. We present an effective and flexible laser-based approach to structure the poly-Si layer after its full-area deposition. Laser pulses with a pulse duration of 9 ps and a wavelength of 355 nm trigger an amorphization of the poly-Si surface. The minimum threshold fluence for amorphization is between 89 and 129 mJ/cm2. The a-Si layer, which is laterally homogeneous and up to (33 ± 4) nm in thickness, works as an etch barrier in an alkaline solution. The most robust barrier corresponding to the maximum thickness of the a-Si layer is found for a fluence of (270 ± 30) mJ/cm2. Besides the impact of the laser fluence on the etch resistiveness of the modified poly-Si layer, we study the role of oxygen during the laser process. We find that oxygen becomes incorporated into the material for certain laser fluences, which results in a more robust etch barrier. The amount of oxygen incorporated is below 3 wt. %. Eventually, we present a phenomenological model of our findings. [ABSTRACT FROM AUTHOR]

ISFH is following a distinct cell development roadmap, which comprises—as a short‐term concept—the combination of an n‐type doped electron‐collecting poly‐Si on oxide (POLO) junction with an Al‐alloyed p+ junction for hole collection. This combination can be integrated either in front‐ and back‐contacted back junction cells (POLO‐BJ) or in interdigitated back‐contacted cells (POLO‐IBC). Here, we present recent progress with these two cell concepts. We report on a certified M2‐sized 22.9% efficient POLO‐BJ cell with a temperature coefficient TCη of only −(0.3 ± 0.02) %rel/K and a certified 23.7% (4 cm2 d.a.) efficient POLO‐IBC cell. We discuss various specific conceptual aspects of this technology and present a simulation‐based sensitivity analysis for quantities related to the quality of the hole‐collecting alloyed Al‐p+ junction which are subject to continuous improvement and thus hard to predict exactly. We report that the measured pseudo fill factor values decrease more due to metallization than would be expected from recombination in the metallized regions with an ideality factor of one only. The gap to pseudo fill factor values that are theoretically achievable at the respective open‐circuit voltages is 1.1%abs (Ga‐doped wafer) for POLO‐IBC and 1.4%abs (B‐doped wafer) to 2%abs (Ga‐doped wafer) for POLO‐BJ. With an embedded blocking layer for Ag crystallites in the poly‐Si, we present a concept to reduce this gap. [ABSTRACT FROM AUTHOR]