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Die Bachelorarbeit beschreibt in der theoretischen Einleitung, welche Verpackungsfunktionen es gibt, das österreichische Lebensmittelbuch, Barrierefunktionen sowie die Circular Packaging Design Guideline. Danach wird erklärt, auf welche Methoden zurückgegriffen wurden, um auf die Ermittlung bestimmter Daten des Materials zu kommen. Dazu wurde besonders auf die Hilfe eines FT/IR Spektrometer für die Auswertung der Oberflächen zurückgegriffen, als auch ein UV/VIS Spectrophotometer verwendet, um auf die Messungen von Transmission und Reflexion zu kommen. Weiters wurden sowohl die MAP in den Verpackungen, mit einem ausgewählten Gasmesser, als auch der Gewichtsanteil der Verpackungen ermittelt. Die Vorstellung der Ergebnisse soll aufklären, wie genau man die Ergebnisse der unterschiedlichen Verpackungen ermitteln kann, als auch wie recyclingfreundlich die Proben sind. Im anschließenden Diskussionsteil werden auf Erkenntnisse eingegangen sowie ein Fazit zu jeder eingesetzten Methode geschlossen. The bachelor thesis describes in the theoretical part, the fundamentals of packaging functions, the Austrian food book, barrier functions as well as the circular packaging design guideline. Thereafter methods were mentioned to determine certain data of the materials used for packaging. For this purpose a FT/IR spectrometer was used to evaluate the surfaces of packaging materials and an UV/VIS spectrophotometer helped to measure transmission and reflection of plasticfoils. In addition, the MAP in the packaging, with using a specific gasmeter, and the weight percentage of the packaging were determined. The presentation of the results should clarify what the difficulties were, to determine the results of the different packaging materieals, as well as how recycling-friendly the samples are.

Here we show a new physical-based analytical model of a-IGZO TFTs. TFTs scaling from L=200 μm to L=15 μm and fabricated on plastic foil are accurately reproduced with a unique set of parameters. The model is used to design a zero-VGS inverter. It is a valuable tool for circuit design and technology characterization. cop. 2015 IEEE.

Here we show a new physical-based analytical model of a-IGZO TFTs. TFTs scaling from L=200 μm to L=15 μm and fabricated on plastic foil are accurately reproduced with a unique set of parameters. The model is used to design a zero-VGS inverter. It is a valuable tool for circuit design and technology characterization. cop. 2015 IEEE.

We present a QQVGA (160times120 with 3 sub-pixel) top-emitting AMOLED display with 85ppi resolution using a self-aligned (SA) IGZO TFT backplane on polyimide-foil. The back plane process flow is based on a 5 layer photolithography process. The aperture ratio of the top-emitting OLEDs is approx. 25%. For operation at 6 V supply voltage (VDD), the brightness of the display exceeds 150cd/m2. On the same substrate a 160 stage gate-driver was measured at FHD rate. cop. 2014 Society for Information Display.

We present a QQVGA (160times120 with 3 sub-pixel) top-emitting AMOLED display with 85ppi resolution using a self-aligned (SA) IGZO TFT backplane on polyimide-foil. The back plane process flow is based on a 5 layer photolithography process. The aperture ratio of the top-emitting OLEDs is approx. 25%. For operation at 6 V supply voltage (VDD), the brightness of the display exceeds 150cd/m2. On the same substrate a 160 stage gate-driver was measured at FHD rate. cop. 2014 Society for Information Display.

In the following chapter, the authors conduct a literature survey of current advances in state-of-the-art low-cost, flexible electronics. A new emerging trend in the design of modern semiconductor devices dedicated to scaling-up, rather than reducing, their dimensions is presented. To realize volume manufacturing, alternative semiconductor materials with superior performance, fabricated by innovative processing methods, are essential. This review provides readers with a general overview of the material and technology evolution in the area of macroelectronics. Herein, the term macroelectronics (MEs) refers to electronic systems that can cover a large area of flexible media. In stark contrast to well-established micro- and nano-scale semiconductor devices, where property improvement is associated with downscaling the dimensions of the functional elements, in macroelectronic systems their overall size defines the ultimate performance (Sun and Rogers in Adv. Mater. 19:1897–1916, 2007). The major challenges of large-scale production are discussed. Particular Attention has been focused on describing advanced, short-term heat treatment approaches, which offer a range of advantages compared to conventional annealing methods. There is no doubt that large-area, flexible electronic systems constitute an important research topic for the semiconductor industry. The ability to fabricate highly efficient macroelectronics by inexpensive processes will have a significant impact on a range of diverse technology sectors. A new era “towards semiconductor volume manufacturing. . .” has begun. The chapter is organized in three main sections. The candidate materials for flexible, large-area electronics (LAEs) are discussed in Sect. 14.1. Given the Limitation of this chapter, only selected groups of the semiconductors are presented. The target materials are Si-based inorganic thin-films and their intriguing, organic competitors. The general attributes of the materials suitable for macroelectronics are revised. The challenges associated with volume manufacturing with emphasis on the evolution of the heating technologies are demonstrated in Sect. 14.2. The final conclusions along with the authors’ considerations on the LAEs’ perspectives are given in Sect. 14.3.

In this work a technology to fabricate low-voltage amorphous gallium-indium-zinc oxide thin film transistors (TFTs) based integrated circuits on 25 mu m foils is presented. High performance TFTs were fabricated at low processing temperatures (< 150 degrees C) with field effect mobility around 17 cm(2)/V s. The technology is demonstrated with circuit building blocks relevant for radio frequency identification applications such as high-frequency functional code generators and efficient rectifiers. The integration level is about 300 transistors. (C) 2011 American Institute of Physics. [doi: 10.1063/1.3579529] ispartof: Applied Physics Letters vol:98 issue:16 status: published

In this work a technology to fabricate low-voltage amorphous gallium-indium-zinc oxide thin film transistors (TFTs) based integrated circuits on 25 µm foils is presented. High performance TFTs were fabricated at low processing temperatures (

We introduce a microprocessor made by organic thin-film transistors processed directly onto flexible plastic foil. This is a direct realization of a microprocessor by thin-film technology, i.e., without transfer, on plastic. It paves the way to equip mundane supports and objects with low-cost computing power. We also demonstrate the correct execution of a digital signal-processing task, namely increasing the accuracy of a repetitive digital input by time-averaging. © 2011 IEEE.

Organic flexible electronics is an emerging technology with huge potential growth in the future which is likely to open up a complete new series of potential applications such as flexible OLED-based displays, urban commercial signage, and flexible electronic paper. The transistor is the fundamental building block of all these applications. A key challenge in patterning transistors on flexible plastic substrates stems from the in-plane nonlinear deformations as a consequence of foil expansion/shrinkage, moisture uptake, baking etc. during various processing steps. Optical maskless lithography is one of the potential candidates for compensating for these foil distortions by in-situ adjustment prior to exposure of the new layer image with respect to the already patterned layers. Maskless lithography also brings the added value of reducing the cost-of-ownership related to traditional mask-based tools by eliminating the need for expensive masks. For the purpose of this paper, single-layer maskless exposures at 355 nm were performed on gold-coated poly(ethylenenaphthalate) (PEN) flexible substrates temporarily attached to rigid carriers to ensure dimensional stability during processing. Two positive photoresists were employed for this study and the results on plastic foils were benchmarked against maskless as well as mask-based (ASML PAS 5500/100D stepper) exposures on silicon wafers. © 2009 Copyright SPIE - The International Society for Optical Engineering.

Organic flexible electronics is an emerging technology with huge potential growth in the future which is likely to open up a complete new series of potential applications such as flexible OLED-based displays, urban commercial signage, and flexible electronic paper. The transistor is the fundamental building block of all these applications. A key challenge in patterning transistors on flexible plastic substrates stems from the in-plane nonlinear deformations as a consequence of foil expansion/shrinkage, moisture uptake, baking etc. during various processing steps. Optical maskless lithography is one of the potential candidates for compensating for these foil distortions by in-situ adjustment prior to exposure of the new layer image with respect to the already patterned layers. Maskless lithography also brings the added value of reducing the cost-of-ownership related to traditional mask-based tools by eliminating the need for expensive masks. For the purpose of this paper, single-layer maskless exposures at 355 nm were performed on gold-coated poly(ethylenenaphthalate) (PEN) flexible substrates temporarily attached to rigid carriers to ensure dimensional stability during processing. Two positive photoresists were employed for this study and the results on plastic foils were benchmarked against maskless as well as mask-based (ASML PAS 5500/100D stepper) exposures on silicon wafers. © 2009 Copyright SPIE - The International Society for Optical Engineering.

We present our recent achievements in organic semiconductor technology in two emerging application areas. We show that the performance of our technology approaches the requirements for Electronic Product Coding RFID tags. Also, backplanes of OLED displays are enabled by the unique compatibility of pentacene transistors with high-k gate dielectrics. © 2009 IEEE.

We present our recent achievements in organic semiconductor technology in two emerging application areas. We show that the performance of our technology approaches the requirements for Electronic Product Coding RFID tags. Also, backplanes of OLED displays are enabled by the unique compatibility of pentacene transistors with high-k gate dielectrics. © 2009 IEEE.

Rad obuhvaća ispitivanje utjecaja polivalentne kulture sa Streptococcus lactis Ak-60, Micrococcus M-104, te standardne kulture na zrenje sira trapista u plastičnim folijama. Ispitivanje je pokazalo da je broj bakterija mliječne kiseline štapićastog oblika i broj mikrokoka veći u sirevima sa polivalentnom nego sa standardnom kulturom. Međutim, broj streptokoka je veći u sirevima sa standardnom kulturom. Pokazalo se da je ubrzano zrenje sireva sa polivalentnom kulturom. Provedeno je organoleptičko ocjenjivanje, te su sirevi sa polivalentnori kulturom dobili više ocjene nego oni sa standardnom., The effect of polyvalent cultures composed from Streptococcus lactis Ak-60 und Micrococcus M-104 on trappist cheese ripening process is investigated and results are compared with the effect of standard cultures. The cheese is vacuum packed in plastic foils. The results of this study show that, during the investigated ripening period, the number of lactobacilli and micrococci in cheese with polyvalent cultures is considerably higher than with standard cultures; on the other hand the number of streptococci in cheeses with standard cultures Is higher. The content of soluble nitrogen with polyvalent cultures without foil after 13 days of ripening, is higher than in the samples with standard cultures (0.207:0.173). The same conclusion can be drawn analysing the 2 samples of cheeses packed in foil, after 20 days of ripening (0.388:0.313). What about organoleptic grades, the cheeses with polyvalent cultures in plastic foils got 18.3 points; without foil 18.0 points; with standard cultures in foils 14.7 points and without foil 12.5 points. Polyvalent cultures Str. lactis Ak-60 and Micrococcus M-104 can be successful used for the cheese ripening in plastic foil. The ripening period is shorter and the organoleptic properties better compared to the samples obtained with standard cultures.