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1. Broad Frequency LTCC Vertical Interconnect Transition for Multichip Modules and System on Package Applications

Author

Decrossas, Emmanuel, Glover, Michael D, Porter, Kaoru, Cannon, Tom, Mantooth, H. Alan, and Hamilton, M. C

Subjects
Communications And Radar, Electronics And Electrical Engineering
Abstract

Various stripline structures and flip chip interconnect designs for high-speed digital communication systems implemented in low temperature co-fired ceramic (LTCC) substrates are studied in this paper. Specifically, two different transition designs from edge launch 2.4 millimeter connectors to stripline transmission lines embedded in LTCC are discussed. After characterizing the DuPont (sup trademark) 9K7 green tape, different designs are proposed to improve signal integrity for high-speed digital data. The full-wave simulations and experimental data validate the presented designs over a broad frequency band from Direct Current to 50 gigahertz and beyond.

Published
2013

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