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We report high room-temperature mobility in single layer graphene grown by Chemical Vapor Deposition (CVD) after wet transfer on SiO$_2$ and hexagonal boron nitride (hBN) encapsulation. By removing contaminations trapped at the interfaces between single-crystal graphene and hBN, we achieve mobilities up to$\sim70000cm^2 V^{-1} s^{-1}$ at room temperature and$\sim120000cm^2 V^{-1} s^{-1}$ at 9K. These are over twice those of previous wet transferred graphene and comparable to samples prepared by dry transfer. We also investigate the combined approach of thermal annealing and encapsulation in polycrystalline graphene, achieving room temperature mobilities$\sim30000 cm^2 V^{-1} s^{-1}$. These results show that, with appropriate encapsulation and cleaning, room temperature mobilities well above $10000cm^2 V^{-1} s^{-1}$ can be obtained in samples grown by CVD and transferred using a conventional, easily scalable PMMA-based wet approach.

Heterostructures formed by stacking layered materials require atomically clean interfaces. However, contaminants are usually trapped between the layers, aggregating into blisters. We report a process to remove such blisters, resulting in clean interfaces. We fabricate blister-free regions of graphene encapsulated in hexagonal boron nitride of$\sim$5000$\mu $m$^{2}$, limited only by the size of the exfoliated flakes. These have mobilities up to$\sim$180000cm$^2$V$^{-1}$s$^{-1}$ at room temperature, and$\sim$1.8$\times$10$^6$cm$^2$V$^{-1}$s$^{-1}$ at 9K. We further demonstrate the effectiveness of our approach by cleaning heterostructures assembled using graphene intentionally exposed to polymers and solvents. After cleaning, these samples reach similar high mobilities. We also showcase the general applicability of our approach to layered materials by cleaning blisters in other heterostructures based on MoS$_{2}$. This demonstrates that exposure of graphene to processing-related contaminants is compatible with the realization of high mobility samples, paving the way to the development of fab-based processes for the integration of layered materials in (opto)-electronic devices.

Van der Waals heterostructures have emerged as promising building blocks that offer access to new physics, novel device functionalities, and superior electrical and optoelectronic properties. Applications such as thermal management, photodetection, light emission, data communication, high-speed electronics and light harvesting require a thorough understanding of (nanoscale) heat flow. Here, using time-resolved photocurrent measurements we identify an efficient out-of-plane energy transfer channel, where charge carriers in graphene couple to hyperbolic phonon polaritons in the encapsulating layered material. This hyperbolic cooling is particularly efficient, giving picosecond cooling times, for hexagonal BN, where the high-momentum hyperbolic phonon polaritons enable efficient near-field energy transfer. We study this heat transfer mechanism through distinct control knobs to vary carrier density and lattice temperature, and find excellent agreement with theory without any adjustable parameters. These insights may lead to the ability to control heat flow in van der Waals heterostructures.