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A series of ester‐ and fluoro‐containing thermoplastic polyimide (PI) films, PEsI‐1 ~ PEsI‐4 have been prepared by the two‐step thermal imidization procedure via the soluble poly(amic acid) (PEsAA) precursors from the copolymerization of four monomers, including the dianhydrides of bisphenol A dibenzoate‐3,3′,4,4′‐tetracarboxylic acid dianhydride (TMBPA) and 3,3′, 4,4′‐biphenyl tetracarboxylic acid dianhydride (BPDA) and the diamine monomers of 4‐aminophenyl‐4′‐ aminobenzoate (APAB) and 2,2′‐bis(trifluoromethyl)‐4,4′‐diamino biphenyl (TFMB) in the polar aprotic solvent of N‐methyl‐2‐pyrrolidinone (NMP). The PI films obtained from the high‐temperature dehydration of the PEsAA solutions exhibited the good thermal stabilities with the glass transition temperatures (Tg) over 269°C, the 5% weight loss temperatures (T5%) higher than 480°C, and the linear coefficients of thermal expansion (CTE) values in the range of 17.7 × 10−6/K–33.6 × 10−6/K in the temperature range of 50–250°C. Meanwhile, the PI films showed good thermoplasticity in the dynamic mechanical analysis (DMA) tests, in which the storage modulus of the PI films dropped sharply in the temperature range of glass transition of the polymers. At last, the PI films exhibited the good dielectric properties with the breakdown voltages (Vb) over 5200 V, the dielectric strength (Ds) higher than 210 V/μm, the dielectric constants (Dk) in the range of 3.26 ~ 3.32 at the frequency of 10 GHz, and the dielectric dissipation factors (Df) of 0.0038 ~ 0.0047. Compared with the commonly used PEsI‐ref film for high‐frequency flexible copper clad laminates (FCCL), the currently developed PI films exhibited the obviously increased Tg values, decreased CTE values, and comparable dielectric properties. [ABSTRACT FROM AUTHOR]

Colorless and transparent semi‐alicyclic fluoro‐containing polyimide (PI) nanocomposite films with enhanced high‐temperature dimensional stability and sustained optical transparency were designed and prepared via incorporation of nano‐sized colloidal silica (SiO2) fillers into the PI matrix derived from hydrogenated pyromellitic dianhydride (HPMDA) and 2,2′‐bis[(4‐aminophenoxy)phenyl]hexafluoropropane (BDAF). The derived PI composite films, abbreviated as 6FCPI‐X in which X stands for the weight percent of the SiO2 in the composite films, exhibited superior thermal and comparable optical properties to the pristine 6FCPI‐0 (6FDA‐BDAF) matrix film. For example, as for the thermal properties, 6FCPI‐35 composite film showed a glass transition temperature (Tg) of 279.1°C and a residual weight ratio at 750°C (Rw750) of 66.1%, which were apparently higher than those of 6FCPI‐0 matrix (Tg = 272.2°C; Rw750 = 47.1%). More importantly, the 6FCPI/SiO2 nanocomposite films showed obviously lower linear coefficients of thermal expansion (CTE) values as compared with that of the 6FCPI‐0 matrix. 6FCPI‐35 composite film showed a CTE value of 36.1 × 10−6/K in the temperature range of 50–250°C, which was lower than half of that of the 6FCPI‐0 matrix (CTE = 77.9 × 10−6/K) in the same range of temperature. In addition, incorporation of nano‐sized colloidal SiO2 particles basically maintained the intrinsically good optical properties of the pristine 6FCPI‐0 matrix film. 6FCPI‐35 composite film showed the optical transmittances of 81.7%, 85.3%, and 87.2% at the wavelength of 400 nm (T400), 450 nm (T450), and 500 nm (T500), respectively, which were in the same level with those of the 6FCPI‐0 film (T400 = 84.0%; T450 = 86.3%; T500 = 87.6%). The 6FCPI series of nanocomposite films also exhibited similar CIE Lab color parameters, including the yellow indices (b*) lower than 2.0 and haze values lower than 1.0%. [ABSTRACT FROM AUTHOR]

Light-colored and transparent polyimide (PI) films with good high-temperature dimensional stability are highly desired for advanced optoelectronic applications. However, in practice, the simultaneous achievement of good optical and thermal properties in one PI film is usually difficult due to the inter-conflicting molecular design of the polymers. In the present work, a series of PI-SiO2 nanocomposite films (ABTFCPI) were developed based on the PI matrix derived from hydrogenated pyromellitic anhydride (HPMDA) and an aromatic diamine containing benzanilide and trifluoromethyl substituents in the structure, 2,2′-bis(trifluoromethyl)-4,4′-bis [4-(4-aminobenzamide)]biphenyl (ABTFMB). The inorganic SiO2 fillers were incorporated into the nanocomposite films in the form of colloidal nanoparticles dispersed in the good solvent of N,N-dimethylacetamide (DMAc) for the PI matrix. The derived ABTFCPI nanocomposite films showed good film-forming ability, flexible and tough nature, good optical transparency, and good thermal properties with loading amounts of SiO2 up to 30 wt% in the system. The ABTFCPI-30 film with a SiO2 content of 30 wt% in the film showed an optical transmittance of 79.6% at the wavelength of 400 nm (T400) with a thickness of 25 μm, yellow index (b*) of 2.15, and 5% weight loss temperatures (T5%) of 491 °C, which are all comparable to those the pristine ABTFCPI-0 matrix without filler (T400 = 81.8%; b* = 1.77; T5% = 492 °C). Meanwhile, the ABTFCPI-30 film exhibited obviously enhanced high-temperature dimensional stability with linear coefficients of thermal expansion (CTE) of 25.4 × 10−6/K in the temperature range of 50 to 250 °C, which is much lower than that of the AMTFCPI-0 film (CTE = 32.7 × 10−6/K). [ABSTRACT FROM AUTHOR]