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This review delves into the progress made in additive manufacturing through the incorporation of conductive fillers in nanocomposites. Emphasizing the critical role of percolation and conductivity, the study highlights advancements in material selection, particularly focusing on carbon nanotubes with low percolation thresholds. The practical applications of these nanocomposites in additive manufacturing polymer composites are explored, emphasizing the understanding of percolation thresholds. Furthermore, the present review paper investigates the potential of these materials as lightweight alternatives for electromagnetic interference shielding (EMI), particularly in key sectors such as automotive and aerospace industries. The integration of advanced materials, modeling techniques, and standardization is discussed as pivotal for successful implementation. Overall, the review underscores the significant strides in enhancing electrical properties and electromagnetic interference shielding capabilities through the strategic use of conductive filler nanocomposites in additive manufacturing. [ABSTRACT FROM AUTHOR]

Nanostructures are playing significant roles in the development of new functions and the enhancement of the existing functions of industrial devices such as sensors, transistors, diodes, lithium-ion batteries, and photovoltaic cells, due to their piezoelectricity, biocompatibility, and pyroelectrical characteristics. This research focused on the review of the characteristics of different nanostructures and nanomaterials such as ZnO, ZnS, MoS2, GO, TiO2, SnO2, and Fe2O3, their fabrication techniques, growth mechanisms, and applications. The factors affecting the growth mechanisms, the crystallographic natures, growth models of anisotropic nanostructures, and growth of nanocrystals, were also highlighted in this research. The existence of lattice mismatch, differential thermal expansion, and high deposition temperature, have affected uniform deposition of nanoparticles on substrates and caused heteroepitaxy, which has resulted in defective nanostructures. Although heteroepitaxy has negatively affected the characteristics and potential applications of nanostructures, it has also opened new research frontiers for potential new applications of nanostructures. The use of nanostructures for gas sensing is attributed to the high specific area, change of resistance on exposure to gases, and high photoconduction abilities, while the photon-carrier collection abilities and anti-reflectance qualities are vital for solar photovoltaic cells. Nanostructures have also been used as coating pigments to prevent corrosion of facilities, reduce urban heat islands and energy consumptions, due to the near infrared (NIR) reflective characteristics.

Empirical formulas were derived for the interface shape, mechanical properties, and electrical characteristics of accumulative roll bonded (ARB) Cu/Nb laminated materials, based on relevant literature data. These formulas were incorporated into a forward analysis model using finite element analysis, enabling the calculation of yield stress and conductivity from the spatial distribution of Cu/Nb two phases. By randomly varying the layer thickness and interface shape in the two-phase spatial distribution and conducting repeated forward analyses, a database linking microstructural descriptors with yield stress and conductivity was created. These microstructural descriptors include volume fraction, geometric features, topological features, spatial correlation functions, and persistent homology. The significance of each microstructural descriptor on yield stress and conductivity was quantified using machine learning techniques. The results revealed that the Cu volume fraction, layer thickness, and 0th Betti number are crucial for yield stress, while for conductivity, the Cu volume fraction has the strongest influence, followed by layer thickness and layer continuity. Based on these outcomes, the Pareto front for ARB Cu/Nb laminates in the strength-conductivity space was presented. [ABSTRACT FROM AUTHOR]