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This study performed a steady-state numerical analysis to understand the temperature in different heat sink configurations for LED applications. Seven heat sink configurations named R, H-6, H-8, H-10, C, C3, and C3E3 were considered. Parameters like input power, number of fins, heat sink configuration were varied, and their influence on LED temperature distribution, heat sink thermal resistance and thermal interface material temperature were studied. The results showed that the temperature distribution of the H-6 heat sink decreased by 46.30% compared with the Cheat sink for an input power of 16 W. The result of the H-6 heat sink shows that the heat sink thermal resistance was decreased by 73.91% compared with the Cheat sink at 16 W. The lowest interface material temperature of 54.11 °C was achieved by the H-6 heat sink when the input power was used 16 W. The H-6 heat sink exhibited better performance due to more surface area with several fins than other heat sinks.

The current experimental investigation focused on the 16 W Light Emitting Diode (LED) with Phase Change Material (PCM)-filled heat sinks to augment consistency, high luminous flux and heat sink with low thermal resistance. Parameters such as input power, fin pitch value and quantity of fins were varied to study the heat transfer performance of the heat sink without and with PCM. Experimental results reveal that the hexagonal heat sink having a pitch of 10 mm performed well due to the increased melting rate of PCM as compared to other heat sinks. The thermal resistance of the H-10 heat sink with PCM was observed to be 3.3 °C/W, which is 73% lower than that of the H-10 heat sink without PCM at 16 W. The junction temperature enhancement ratio of 3.625 was observed for the H-10 heat sink with PCM at 16 W power input for SCT of 90 °C. [ABSTRACT FROM AUTHOR]