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1. The Interaction of 2 SOLDER PASTE ALLOYS with 5 Surface Finishes, Part 2: SAC 305 shows faster shear strength degradation than Innolot, while the surface finish has no effect

2. The Interaction of 2 SOLDER PASTE ALLOYS with 5 Surface Finishes: For spread and wetting performance, certain finishes stand out

4. High-Reliability, Fourth-Generation LOW-TEMPERATURE SOLDER Alloys: Results of melting behavior, solder joint formation, tensile strength and high-temperature creep tests

5. Patterning Nanoroads and Quantum Dots on Fluorinated Graphene

11. iNEMI project on process development of BiSn-based low temperature solder pastes: Part III: Mechanical shock tests on POP BGA assemblies

12. iNEMI project on process development of BISN-based low temperature solder pastes — Part II: Characterization of mixed alloy BGA solder joints

15. Nanotube nucleation versus carbon-catalyst adhesion–Probed by molecular dynamics simulations.

16. Wafer level CSP with ultra-high thermal reliability lead-free alloys

23. H-Spillover through the Catalyst Saturation: An Ab InitioThermodynamics Study

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