Search

Currently, attacks on side channels are the main method of cryptanalysis, but despite this, these attacks have a very specific model of the attacker. As a result, the practical usage of side-channel attacks is sometimes disputable. The level of threat in each case should be assessed taking into account the individual characteristics of a specific target system. Client applications, such as mobile phone applications, are especially vulnerable due to easy access to the device, so it's required to pay sufficient attention to their security, since they are more accessible to the attacker and usually contain a large amount of confidential information. This study represents an assessment of the informativeness of signals from side channels received from mobile phones. The studies used not expensive equipment to minimize the requirements for the level of the attacker and, consequently, increase the applicability of the attack. This undoubtedly leads to the complication of the attacks, so the NICV algorithm was used to analyze the data obtained. The NICV (normalized interclass variance) algorithm can significantly improve the efficiency of the analysis of the traces obtained during an attack by reducing the number of points.

Multiple, simultaneous trends emerging in semiconductor device technology pose challenges both in engineering manufacturable processes and with developing efficient, fast metrology and inspection solutions with improved sensitivity for process control. For instance, both memory and logic use 3D structures now-manufacturers no longer deal with simple planar structures but must monitor sidewall thickness, conformality, and repeatability of deposition and etch processes to engineer complex shape profiles, deep trenches, and contact holes with excellent uniformity. Material complexity also continues to increase significantly; for example, the metal gates of today can consist of up to 6 or more layers (most of which are only a few nm thick), compared to a single layer of thick polysilicon several nodes back. In addition, the process and metrology budgets for most processes continue to shrink along with particle and defect sizes of relevance. All these factors result in increased metrology techniques used to monitor IC manufacturing today. This paper presents an overview of these techniques, covering some of the challenges and solutions in metrology and inspection for emerging technology nodes.

Recent time the mobile phones became the main device for the modern society members. Of course, it means that they also became the main target of the attackers. Our team is working on the issue of the mobile security regarding the side-channel attacks. We have faced with a number of challenges which the attacker has to overcome to obtain the sensitive data, but at the same time our research shows that the severity level of the side-channel attacks threat for the mobile security is even more high then we can assume. The instrument available for the any potential malefactor, the consumer-level device, and realy simple technique of the trace gathering allow to distinguish the cryptographic operations in dependency on the used input data. Although on this equipment level the obtaining of the key data is not possible, the attacking algorythms designed during the our research will allow to reach this goal on the more detailed signal records.

Mobile social networks (MSNs) are the networks of individuals with similar interests connected to each other through their mobile devices. Recently, MSNs are proliferating fast supported by emerging wireless technologies that allow to achieve more efficient communication and better networking performance across the key parameters, such as lower delay, higher data rate, and better coverage. At the same time, most of the MSN users do not fully recognize the importance of security on their handheld mobile devices. Due to this fact, multiple attacks aimed at capturing personal information and sensitive user data become a growing concern, fueled by the avalanche of new MSN applications and services. Therefore, the goal of this work is to understand whether the contemporary user equipment is susceptible to compromising its sensitive information to the attackers. As an example, various information security algorithms implemented in modern smartphones are thus tested to attempt the extraction of the said private data based on the traces registered with inexpensive contemporary audio cards. Our obtained results indicate that the sampling frequency, which constitutes the strongest limitation of the off-the-shelf side-channel attack equipment, only delivers low-informative traces. However, the success chances to recover sensitive data stored within a mobile device may increase significantly when utilizing more efficient analytical techniques as well as employing more complex attack equipment. Finally, we elaborate on the possible utilization of neural networks to improve the corresponding encrypted data extraction process, while the latter part of this paper outlines solutions and practical recommendations to protect from malicious side-channel attacks and keep the personal user information protected.

On one hand, side-channel attacks are a powerful approach to cryptoanalysis, on the other hand, these attacks have a very specific attacker model. As a result, a practical application of SCA is sometimes disputable. The threat level in each case has to be evaluated given individual features of a certain target system. Endpoint client applications like mobile phone applications are especially vulnerable because of an uncomplicated access to the device. More attention has to be paid to their security since they’re more accessible to an attacker and usually carry a large amount of sensitive information.

Minimizing defects on production wafers is critical for fab yield ramp and high volume manufacturing. Understanding the defect reduction process is essential for successfully implementing and validating corrective measures. A structured approach to defect root cause identification and correction is essential for achieving increasingly smaller defects with technology scaling from 28nm planar to 7 nm FINFET and with increasing stacks of 3DNAND memory. Such an approach leverages a defect knowledge base, broad equipment design and process expertise, and proven best-known methods—in addition to state-of-the-art metrology, inspection, and analysis technologies.

Heat capacity measurements on C 60 were carried out by differential scanning calorimetry from 120 to 560 K. This heat capacity was linked based on existing normal-mode and lattice calculation, to the vibrational heat capacities. In this way the thermodynamc functions are available from absolute zero of temperature. The phase transition at 256 K could be intified as a crystal-to-plastic crystal transition with an increase in entropy of 27.3 J/(K mol)