1. The Influence of Thermal Residual Stresses on Mechanical Properties of Silicon Nitride-Based Composites
- Author
-
S. J. Skrzypek, M. Goły, G. Grabowski, and Aleksandra Dubiel
- Subjects
Materials science ,02 engineering and technology ,Hot pressing ,Residual ,01 natural sciences ,lcsh:Technology ,Article ,ceramic–ceramic composites ,chemistry.chemical_compound ,0103 physical sciences ,Thermal ,Silicon carbide ,General Materials Science ,Composite material ,lcsh:Microscopy ,residual thermal stresses ,FEM modeling ,lcsh:QC120-168.85 ,010302 applied physics ,lcsh:QH201-278.5 ,sin2ψ ,lcsh:T ,sin2 ,021001 nanoscience & nanotechnology ,Microstructure ,Titanium nitride ,Finite element method ,silicon nitride ,chemistry ,Silicon nitride ,lcsh:TA1-2040 ,lcsh:Descriptive and experimental mechanics ,lcsh:Electrical engineering. Electronics. Nuclear engineering ,0210 nano-technology ,lcsh:Engineering (General). Civil engineering (General) ,lcsh:TK1-9971 - Abstract
In this work, two kinds of silicon nitride-based composites, namely, those with titanium nitride or silicon carbide additives, were sintered using the hot pressing technique (HP). The phase composition, microstructure, and mechanical and elastic properties of the materials were characterized. Three-dimensional geometric models of the composites were created on the basis of microstructure parameters. Using these models, bulk residual thermal stresses were calculated by the finite element method (FEM). Surface stresses were determined using the XRD method of sin2ψ.
- Published
- 2020
- Full Text
- View/download PDF